How Does a Project Go?　(EDPM)

How Does a Project Go?　2008-06-27 22:00
分类：职业
字号： 大大 中中 小小
Abstract
A. NPI Project Team Members
B. NPI Project Phases
RFX (Request for ~ )
Kick-Off
EVT (Engineering Validation Test)
DVT (Developing Validation Test)
PVT (Production Validation Test)
C. Appendix – NPI Check List
NPI Project Team Members
? EPM – schedule, qualification, coordination
? HW/EE – PCBA….
? ME – Case, Cable, Accessories….
? SW – CD contents, Applications…
? Packing – Packaging, Manual, CD Artworks…
? Test Team – In-house & Out-side Lab
? Sales – Business Issues
? MPM – yield rate, factory coordination
NPI Project Phases

[]RFX (Request for ~ )[/]

RFI - Information
RFP - Proposal
RFQ - Quotation

[]Kick-Off[/][]EVT (Engineering Validation Test)[/][]DVT (Developing Validation Test)[/][]PVT (Production Validation Test)[/][]RFX[/]

? RFI:
Sales - Product Roadmap or market information
? RFP:
Sales - Evaluation Forms
Engineering Evaluation Form
Marketing Evaluation Form
- feedback proposals to customer
PM/RD - provide solutions or proposals
? RFQ:
Sales - Product Check List Product Check List
- feedback quotation to customer
PM - Unit Cost & Tooling/NRE Estimation

[]Project Kick-Off[/]

? Sales –
– Kick-Off Project Application Form
– New Model # Application
? PM –
– Project Team Member List
– Project Schedule
– Setup weekly review con-call with customer
– Apply ftp for data exchange with customer
? RD – Preliminary Product Spec.
– DFS: design for spec
– DFC: design for cost

[]EVT[/]

? ME
– .dxf file to EE for schematics reference
– ID drawing for customer approval
– Case 2D/3D Drawing for sample making
– Mockup Sample (NC-1, NC-2….) for pre-test
– ME Pre-BOM
– Debug for EVT and implement the solutions in DVT
? HW/SW
– Schematics and Layout (gerber) file for PCB fab
– PCBA Pre-BOM (R0A, R0B…)
– Debug for EVT and implement the solutions in DVT
? Test Team –
– Test Plan release
– Pre-test EMI, Thermal…
– Test result release and possible solutions recommend to RD
? PM
– Test Plan clarification with customer
– EVT/DVT required sample q’ty internally/ externally
– Pre-BOM release w/ cost
– Phase Transition Meeting w/ Bug tracking List
? Sales
– Long Lead time Material (IC) preparation for PVT/MP per PM/RD confirmation
– Exportation Contract Application per pre-BOM
– Margin review per the pre-BOM cost

[]DVT[/]

? ME
– Tooling Release if EMI pre-scan pass (tooling LT=3wk~1M)
– Debug for DVT (ME T1, T2….) implement to next version
? HW/SW
– Debug for DVT (PCBA R01, R02…) implement to next version
? PK
– Package Drawing for testing sample (re-design if ME test fails)
– die cut release for artwork design
? Test Team (T1/T2…. + R01/R02….)
– In-house System Test
? Reliability/Compatibility Test
? Environmental Test: Thermal/Humidity
? ME Test: Shock/Vibration/Drop….
– Out-side Lab Certification
? Certification List
? USB-IF/WHQL (Microsoft-Windows Hardware Quality Labs)
? Factory
– DVT Build and production issue list and yield report
– DFM (design for manufacturing) Review
? PM
– DVT Test Plan finalization w/ customer
– E-BOM release (PN application) and cost review
– Phase Transition Meeting w/ Bug tracking List
– Schedule review and update
? Sales
– NRE Order tracking/reception from customer
– Material Preparation (PCB, long lead-time) for PVT/MP
– Margin review per updated cost

[]PVT[/]

? ME: T-final
– FAI (first article inspection)
– TVR (tooling validation report)
– Approval Sheet for ME parts
– ME M-BOM release
– On-site support for PP run
? HW/SW
– PCBA design frozen (fix all the bugs)
– EE M-BOM release
– Approval Sheet for EE parts
? PK
– Artworks for packing, CD and manual/QIG…and sample approval
– Packing guideline from customers
– PK Kit M-BOM release
? Factory
– M-BOM review and material preparation
– PP run (customer audit)
– PP run meeting to conclude if agree to MP or not
? PM
– Product M-BOM release
– Close the bug tracking -> Temp. Approval part list
– Critical issues solving schedule and max order q’ty
– Cost review
– On-site support for PP run
– Phase Transition meeting
? Sales
– MP order from customer
– Shipping schedule/documents for consigned parts
– Forecast release and following material preparation if necessary
Appendix: NPI Check List
Definition:
C0 phase – MRS (RFX)
C1 phase – EVT
C2 phase – DVT
C3 phase – PVT
C4 phase - MP
Appendix: C0 (MRS) Check List
C001 市場分析報告(Marketing Analysis report) èMKT/SALES
C002 新產品提案(New product proposal) èMKT/SALES
C003 經營計劃 (Business Plan) èMKT/SALES
C004 專案可行性報告 (Project Feasibility report) èMKT/SALES
C005 市場需要規格 (Market Requirement Specification) èMKT/SALES
C006 軟體提供報告 (S/W Sourcing Report) èMKT/SALES
C007 專案團隊組織 (Project team organization) èPM
C008 機種編號清單 (Model No. List) èPM
C009 初步的工程規範 (Preliminary Engineering Specification) èR&D
C010 初步的結構清單 (Preliminary Configuration List) èPM
C011 新產品開發計劃 (New product Development Plan) è R&D
C012 一次費用的預算 (NRE Estimation) èPM
C013 專案進度表 (Project Schedule) èPM
C014 C0階段查檢表 (C0 Phase Check list) èPM
Appendix: C1 (EVT) Check List
C101 產品外部規格 (Product external specification) èR&D
C102 產品內部規格 (Product internal specification) èR&D
C103 外觀完成設計 (Finalize ID) èR&D
C104 產品機能的方塊圖 (Product Functional Block) èR&D
C105 FPGA設計-假使需要 (FPGA Design-if necessary) èR&D
C106 機板布局確認表 (PCB layout check list) èR&D
C107 Gerber檔案 (Gerber file) èR&D
C108 包裝概念設計 (Packing Concept Design) èR&D
C109 材料表 (EBOM parts list) èR&D
C110 原型機 (Mockup) èR&D
C111 設計測試計畫 (Design test plan for EVT)
C112 改善行動報告 (Improvement action report) èR&D
C113 軟體設計單 (S/W Design Sheet) èR&D
C114 為制造的設計 (Design for manufacturer) (DFM) èR&D-QRA
C115 為維修的設計 (Design for repair) (DFR) èR&D-QRA
C116 結構清單 (Configuration list) èPM
C117 一次費用的審查 (NRE estimation) èPM
C118 DVT測試程序 (DVT test procedure) èQRA
C119 DVT測試計劃 (DVT test plan) èQRA
C120 品質管理計劃 (QMP) èQRA
C121 主要供應商的矩陣表 (Key supplier matrix) èPUR
C122 初步的合格廠商清單 (preliminary AVL) èPUR
C123初步的制程設計 (Preliminary process design) èENG
C124 專案進度表 (Project schedule) èPM
C125 C1階段查檢表 (C1 phase check list) èPM
Appendix: C2 (DVT) Check List – 1
C201 技術轉移清單 (Product specs technical transfer list) èR&D
C202 材料表 (EBOM) èR&D
C203 EMC 評估報告 (EMC evaluation report) èR&D
C204 safety 評估報告 (safety evaluation report) èR&D
C205 PCBA位置圖 (PCBA artwork drawing) èR&D
C206 包裝圖面 (Packing drawing) èR&D
C207 機構圖 (Mechanical drawing) èR&D
C208 組裝圖 (Assembly drawing) èR&D
C209 軟體原始碼 (S/W source code) èR&D
C210 開發進度表 (Development schedule) èR&D
C211 PAL/PROM 資料表 (PAL/PROM Data listing) èR&D
C212 DCN 控制表(DCN Control list) èR&D
C213 RMA備用品材料表 (RMA spare part EBOM) èR&D-QRA
C214 工作樣品 (working sample) èENG
C215 ICT功能需求 (ICT function requirement) èENG
C216 測試 & 制造設備. 治具清單 (test & manufacture equipment & fixture list) èENG
C217 制程管理計劃 (PMP) èENG
C218 標準作業程序書 (SOP) èENG
C219 生產流程圖 (Production flow) èENG
C220 包裝標準 (Packing standard) èENG
C221 RMA備用品標準包裝 (RMA Spare part standard packing) èENG
C222 組裝程序 (Assembly procedure) èENG
C223 標準工時 (Time standard) èENG
C224 測試程序 (Test procedure) èENG
C225 零件檢驗計劃 (PIP) èENG
C226 模具評估報告 (Tooling evaluation report) èENG
C227 模具首件檢查 (Tooling first article) èENG
C228 模具確認單 (tooling check list) èENG
C229 合格廠商審核 (AVL review) èQRA
C230 DVT測試報告 (DVT test report) èQRA
C231 PVT測試程序 (PVT Test procedure) èQRA
C232 PVT測試計劃 (PVT test plan) èQRA
C233 品質管理計劃 (QMP) èQRA
C234 良率分析報告 (Yield rate analysis report) èQRA
C235 IQC檢驗查檢表 (IQC inspection check list) èQRA
C236 主要零件的策略 (key component strategy) èPUR
C237 主要零件的狀況 (key component status) èPUR
C238 零件采購狀況 (Long lead time parts status) èPUR
C239 專案進度表 (project schedule) èPM