HP產品無鉛零件使用指導書
HP產品無鉛零件使用指導書
Revision History
First release 6/30/03
Overview of the transition to lead(Pb)-free electronics
無鉛電子業轉換展望
Impending legislation in Europe is forcing a transition in the electronics industry away
from the use of lead (Pb) in electronic products. HP is aware that many suppliers will be
transitioning to lead-free products before the legislation becomes effective in July 2006.
Your HP procurement representative(s) must be notified of any transition to Pb-free
products in the form of company roadmaps, engineering change notifications (ECNs)
and/or product change notifications (PCNs). The following procurement guidelines are
intended to guide the Pb-free transition plans of HP’s suppliers and the introduction of
Pb-free components and materials into HP products.
歐洲未來立法將要求電子業轉換，取消電子產品中鉛的使用。HP意識到在2006年7月立法生效之前其供應商須轉換成生產無鉛產品。通過公司路標， 工程變更(ECNs) 或產品變更通知(PCNs)等方式, 貴司所聯系之HP相應代理人須了解無鉛產品轉換. 如下使用指導書意在指導HP供應商制定無鉛轉換計劃並將無鉛零件及材料用於HP產品中。
HP expects that suppliers, who are transitioning to Pb-free solutions to meet the
impending European legislation, will choose Pb-free alternatives that are approved by
HP. Please follow “HP’s position on tin-based plating for Pb-free components” in
Appendix A for recommended plating solutions. These procurement guidelines provide
more detail and offer acceptable solutions for plated components and area array
packages. More plating solutions are acceptable for HP’s consumer products than for
HP’s high reliability products. However, solutions recommended in HP’s position
statement are acceptable for all product classes. It should be noted that product
organizations have ultimate control over the acceptance of components and materials.
For more information on HP’s requirements and the progress toward lead elimination in
electronics, please contact your HP procurement representative.
HP希望其供應商選擇HP授權之無鉛方案來實行無鉛策略轉換以滿足迫近的歐洲立法. 電鍍建義方法可參照 Appendix A “HP’s position on tin-based plating for Pb-free components” (“HP無鉛零件錫類電鍍定義”)
Revision History
First release 6/30/03
Overview of the transition to lead(Pb)-free electronics
無鉛電子業轉換展望
Impending legislation in Europe is forcing a transition in the electronics industry away
from the use of lead (Pb) in electronic products. HP is aware that many suppliers will be
transitioning to lead-free products before the legislation becomes effective in July 2006.
Your HP procurement representative(s) must be notified of any transition to Pb-free
products in the form of company roadmaps, engineering change notifications (ECNs)
and/or product change notifications (PCNs). The following procurement guidelines are
intended to guide the Pb-free transition plans of HP’s suppliers and the introduction of
Pb-free components and materials into HP products.
歐洲未來立法將要求電子業轉換，取消電子產品中鉛的使用。HP意識到在2006年7月立法生效之前其供應商須轉換成生產無鉛產品。通過公司路標， 工程變更(ECNs) 或產品變更通知(PCNs)等方式, 貴司所聯系之HP相應代理人須了解無鉛產品轉換. 如下使用指導書意在指導HP供應商制定無鉛轉換計劃並將無鉛零件及材料用於HP產品中。
HP expects that suppliers, who are transitioning to Pb-free solutions to meet the
impending European legislation, will choose Pb-free alternatives that are approved by
HP. Please follow “HP’s position on tin-based plating for Pb-free components” in
Appendix A for recommended plating solutions. These procurement guidelines provide
more detail and offer acceptable solutions for plated components and area array
packages. More plating solutions are acceptable for HP’s consumer products than for
HP’s high reliability products. However, solutions recommended in HP’s position
statement are acceptable for all product classes. It should be noted that product
organizations have ultimate control over the acceptance of components and materials.
For more information on HP’s requirements and the progress toward lead elimination in
electronics, please contact your HP procurement representative.
HP希望其供應商選擇HP授權之無鉛方案來實行無鉛策略轉換以滿足迫近的歐洲立法. 電鍍建義方法可參照 Appendix A “HP’s position on tin-based plating for Pb-free components” (“HP無鉛零件錫類電鍍定義”)
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waft (威望:0) (广东 东莞) 电子制造 主管 - ISO9001:2008;ISO14001:20...
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聚合體零件材料使用（如成型混合物，沖模附屬）
1.1 Material set for use with a Sn-(37-40%)Pb assembly process
Sn-(37-40%)Pb 組裝制程材料使用
Please follow current specifications such as HP’s General Semiconductor Specification
(GSS), General Interconnect Specification (GIS), or other document provided by HP or
its subcontractors. Temperature requirements for nonhermetic packages given in the J-STD-020B to assess the moisture sensitivity level (MSL) are acceptable for Sn-Pb
processes. It should be noted that Pb-free metallurgies discussed in Section 2.0 require
additional testing than covered in the GSS.
請依照現有產品規格書如HP半導體規格書總括(GSS), 互連規格書總括（GIS）或其它由HP或其代理商提供的文件。J-STD-020B中用於評估濕度敏感級別(MSL)的非密閉包裝溫度要求適用於Sn-Pb制程。須注意的是Section 2.0中論述的無鉛治金術除了GSS所涵蓋的內容個還要求進行額外實驗。
1.2 Material set for use with a Pb-free Sn-4Ag-0.5Cu assembly process
Pb-free Sn-4Ag-0.5Cu組裝制程材料使用
In general, please follow current specifications such as HP’s General Semiconductor
Specification (GSS), General Interconnect Specification (GIS), or other document
provided by HP or its subcontractors. However, the following substitutions should be made: (1) conduct preconditioning to a peak temperature of 260℃ or higher to simulate second level assembly with Sn-Ag-Cu solder and (2) specify moisture sensitivity level with a 260℃ peak reflow profile.
總體來說，請依照現有產品規格書如HP半導體規格書總括(GSS), 互連規格書總括（GIS）或其它由HP或其代理商提供的文件。但是， 應進行如下置換：(1)進行260℃以上高溫預熱以模擬 Sn-Ag-Cu 焊接第二級組裝。(2)設定260℃ 過爐的濕度敏感級別。
The high temperatures associated with the Sn-(3.5–4.0%)Ag-(0.5-0.7%)Cu assembly
process prevent adoption of current material sets in most cases for nonhermetic, plastic
packages. The J-STD-020B is NOT acceptable for Pb-free assembly requirements. HP
requires that Pb-free SMT components be qualified to 26℃. This qualification
temperature is applicable to nonhermetic, plastic components, passives, and connectors
intended for SMT processing. Ceramic components may have higher temperature
requirements and wave soldered, through-hole components, hand-loaded components,
and press fit components may have lower temperature requirements. HP’s preliminary
estimate is that wave soldered, through hole components should be qualified to 20℃
在多數情況下Sn-(3.5–4.0%)Ag-(0.5-0.7%)Cu 相關組裝制程高溫可保証使用非密閉塑料包裝。無鉛組裝要求不可使用J-STD-020B. HP要求無鉛SMT 零件溫度必須達到26℃. SMT制程 中所使用非密閉塑料零件， passive 及連接器皆要達到此溫度。陶瓷零件要求達到更高的溫度。而波焊，穿孔零件，手置零件及壓合零件則可有較低的溫度需求。HP初步評估波焊及穿孔零件溫度隻須達到20℃ 即可。
2.0 Lead-free component terminal metallurgies (for use with conventional Sn-Pb
and lead-free Sn-4Ag-0.5Cu solders)
無鉛零件終端冶金術 (用於傳統 Sn-Pb 和無鉛Sn-4Ag-0.5Cu 焊接)
Three key points should be noted about terminal metallurgies:
o Component metallurgies that are acceptable to one HP business will not
necessarily be acceptable to all HP businesses. HP businesses have different
requirements based on their lifetime and reliability goals.
o HP requests that suppliers continue to provide Sn-Pb components until their Pb-free
components are acceptable to all HP businesses.
終端冶金術需注意三點：單項HP交易所接受的零件冶金術並不說明HP所有交易都接受此零件治金術。 HP交易依據其各自壽命及可靠度目標有不同要求。HP要求其供應商在其所有交易接受無鉛零件之前繼續使用Sn-Pb零件。
Procurement Guidelines for lead(Pb)-free components to be used in HP products for external use
HP Restricted 5
o Pb-free BGAs and CSPs will NOT be accepted for use with Sn-Pb assembly
processes.
Sn-Pb 組裝制程不可使用無鉛BGAs & GSPs
2.1 Lead frames terminal platings (TSOPs,QFPs, etc.)
含鉛終端電鍍 (TSOPs, QFPs etc.)
The acceptability of various terminal platings for lead frame components is listed in
Table 1. A schematic of a leadframe component is shown in Figure 1. Please refer to
“HP’s position statement on Sn-based Pb-free platings” for more information on tin
platings and the reliability risk of tin whiskering (see Appendix A). Recommendations
for all platings are presented assuming a copper-based lead frame, except where an alloy
42 (iron (Fe)-42 nickel(Ni)) lead frame is specified.
Table 1 列出各種含鉛零件終端電鍍接受性。Figure 1為含鉛零件指示圖。如需更多有關錫類電鍍及錫類whiskering可靠度風險信息，可參照Appendix A. HP無鉛Sn類無鉛電鍍決定. 裡面以銅類含鉛為框架介紹了所有電鍍建議，但沒有定義合金42 (iron (Fe)-42 nickel(Ni)) 含鉛框架.