可靠性相关国际规范目录

Major Standards for Reliability and Quality Management of Semiconductor
Devices And ICs

(1) JIS standards
Number Title Established
JIS C 60068-1 Environmental testing Part 1: General and guidance 1993
JIS C 60068-2-1 Environmental testing procedures Part 2: Tests, Tests A:Cold1995
JIS C 60068-2-2 Basic environmental testing procedures Part 2: Tests, TestB:Dryheat1995
JIS C 60068-2-3 Basic environmental testing procedures Part 2: Tests, Test
Ca: Damp heat, steady state
1987
JIS C 60068-2-11 Basic environmental testing procedures Part 2: Tests -- Test
Ka: Salt mist
1989
JIS C 60068-2-52 Environmental testing -- Part 2: Tests -- Test Kb: Salt mist,
cyclic (sodium, chloride solution)
2000
JIS C 0025 Basic environmental testing procedures Part 2: Tests Test
N: Change of temperature
1988
JIS C 0027 Basic environmental testing procedures Part 2: Tests Test
Db: Damp heat, cyclic (12 + 12-Hour cycle)
1988
JIS C 60068-2-13 Basic environmental testing procedures Part 2: Tests, Test
M: Low air pressure
1989
JIS C 60068-2-6 Environmental testing Part 2: Tests -- Test Fc: Vibration
(sinusoidal)
1999
JIS C 60068-2-27 Basic environmental testing procedures Part 2: Tests, Test
Ea and guidance: Shock
1995
JIS C 60068-2-29 Basic environmental testing procedures Part 2: Tests Test
Eb and guidance: Bump
1995
JIS C 60068-2-21 Environmental testing -- Part 2-21: Tests -- Test U:
Robustness of termination and integral mounting devices
2002
JIS C 5003 General test procedure of failure rate for electronic
components
1974
JIS C 7032 General Rules for Transistors 1993
JIS C 7030 Measuring methods for transistors 1993
JIS C 7031 Measuring methods for small signal diodes 1993
JIS Z 8115 Glossary of terms used in dependability 2000

(2) JEDEC standards
Number Title Established
J-STD- Joint IPC/JEDEC Standard 1999-2003
JESD22- JEDEC Standard 1997-2005
• J-STD-(Joint IPC/JEDEC Standard) individual standards
Number Title Established
J-STD-002B SOLDERBILITY TESTS FOR COMPONENT LEADS,
TERMINATIONS, LUGS, TERMINALS AND WIRES
2003
J-STD-020C JOINT IPC/JEDEC STANDARD FOR MOISTURE/REFLOW
SENSITIVITY CLASSFICATION FOR NONHERMETIC SOLID
STATE SURFACE-MOUNT DEVICE
2004
J-STD-033A JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING,
SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE
SURFACE-MOUNT DEVICES
2002
J-STD-035 JOINT IPC/JEDEC STANDARD FOR ACCOUSTIC MICROSCOPY
FOR NONHERMETRIC ENCAPSULATED ELECTRIC
COMPONENT
1999
• JESD22-(JEDEC Standard) individual standards
Number Title Established
JESD22-A100-B CYCLED TEMPERATURE HUMIDITY BIAS LIFE TEST 2000
JESD22-A101-B STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE
TEST
1997
JESD22-A102-C ACCELERATED MOISTURE RESISTANCE—UNBIASWS
AUTOCLAVE
2000
JESD22-A103-C HIGH TEMPERATURE STORAGE LIFE 2004
JESD22-A104C TEMPERATURE CYCLING 2005
JESD22-A105C POWER AND TEMPERATURE CYCLING 2004
JESD22-A106B THERMAL SHOCK 2004
JESD22-A107B SALT ATOMOSPHERE 2004
JESD22-A108C TEMPERATURE, BIAS, AND OPERATING LIFE 2005
JESD22-A109A HERMETICITY 2001
JESD22-A110-B HIGHLY ACCELERATED TEMPERATURE AND HUMIDITY
STRESS TEST (HAST)
1999
JESD22-A111 EVALUATION PROCEDURE FOR DETERMINING
CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL
BODY SOLDER IMMERSION OF SMALL SURFACE
MOUNT SOLID STATE DEVICES
2004
JESD22-A113D PRECONDITIONING OF PLASTIC SURFACE MOUNT
DEVICES PRIOR TO RELIABILITY TESTING
2003
JESD22-A114C.01 ELECTROSTATIC DISCHARGE (ESD) SENSITIVETY
TESTING HUMAN BODY MODEL (HBM)
2005
JESD22-A115-A ELECTROSTATIC DISCHARGE (ESD) SENSITIVITY
TESTING MACHINE MODEL (MM)
1997
JESD22-A117 ELECTRICALLY ERASBLE PROGRAMMABLE ROM
(EEPROM) PROGRAM/ERASE ENDURANCE AND DATA
RETENTION TEST
2000
JESD22-A118 ACCELERATED MOISTURE RESISTANCE—UNBIASED
HAST
2000
JESD22-A119 LOW TEMPERATURE STRAGE LIFE 2004
JESD22-A120.01 TEST METHOD FOR THE MEASUREMENT OF MOISTURE
DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC
MATERIALS USED IN INTEGRATED CIRCUITS
2001
JESD22-A121 Measuring Whisker Growth on Ti and Tin Alloy Surface fishes 2005
JESD22-B SUPERSEDED BY THE TEST METHODS INDICATED BY
"JESD22-"
2000
JESD22-B100B PHYSICAL DIMENTION 2003
JESD22-B101A EXTERNAL VISUAL 2004
JESD22-B102D SOLDERBILITY 2004
JESD22-B103-B VIBRATION, VARIABLE FREQUENCY 2002
JESD22-B104C MECHANICAL SHOCK 2004
JESD22-B105C LEAD INTEGRITY 2003
JESD22-B106C RESISTANCE TO SOLDERING TEMPERATURE FOR
THROUGH-HOLE MOUTED DEVICE
2005
JESD22-B107C MARKING PERMANENCY 2004
JESD22-B108A COPLANARITY TEST FOR SURFACE-MOUNT
SEMICONDUCTOR DEVICES
2003
JESD22-B109 FLIP CHIP TENSILE PULL 2002
JESD22-B110A SUBASEMBLY MECHANICAL SHOCK 2004
JESD22-B111 BOARD LEVEL DROP TEST METHOD OF COMPONENTS
FOR HANDHELD ELECTRONIC PRODUCTS
2003
JESD22-B112 High Temperature Package Warpage Measurement
Methodology
2005
JESD22-B116 WIRE BOND SHEAR TEST 1998
JESD22-B117 BALL GRID ARRAY (BGA) BALL SHAER 2000
JESD22-C100-A HIGH TEMPERATURE CONTINUITY—RESCINDED,
November 1999
1990
JESD22-C101C FILED-INDUCED CHARGED-DEVICE MODEL TEST
METHOD FOR ELECTROSTATIC DISCHARGE
WITHSTAND THRESHOLDS OF MICROELECTRONIC
COMPONENTS
2004
JESD35-A Procedure for the Wafer-Level Testing of Thin Dielectrics 2001
JESD671-A Component Quality Problem Analysis and Corrective Action
Requirements
1999
JESD46-B Customer Notification of Product/Process Changes by
Semiconductor Suppliers
2001
JESD47D Stress-Test-Driven Qualification of Integrated Circuits 2003
JESD48B Product Discontinuance 2005
JESD50A Special Requirements for Maverick Product Elimination 2004
JESD61 Isothermal Electromigration Test Procedure 1997
JESD69 Information Requirements for the Qualification of Silicon
Devices
2000
JESD74 Early Life Failure Rate Calculation Procedure for Electronic
Components
2000
JESD78A IC Latch-Up Test 1997
JESD85 Methods for Calculating Failure Rates in Units of FITs 2001
JESD87 Standard Test Structures for Reliability Assessment of AlCu
Metallizations with Barrier Materials
2001
JESD89 Measurement and Reporting of Alpha Particles and
Terrestrial Cosmic Ray-Induced Soft Errors in Semiconductor
Devices
2001
JESD90 A Procedure for Measuring P-Channel MOSFET Negative
Bias Temperature Instabilities
2004
Section 7 Standards and Certification Schemes for the Quality System, Safety, and Reliability of Semiconductor Devices
Rev. 1.00 Aug. 31, 2006 Page 338 of 410
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Number Title Established
JESD91A Method for Developing Acceleration Models for Electronic
Component Failure Mechanisms
2003
JESD94 Application Specific Qualification Using Knowledge Based
Test Methodology
2004
JESD659-A Failure-Mechanism-Driven Reliability Monitoring 1999
(3) IEC standards
Number Established Title Part
Publication 68 1969-95 Environmental testing Parts 1 to 5
Publication 747 1983-95 Semiconductor devices, —Discrete devices
and integrated circuits
Parts 1 to 12
Publication 748 1984-95 Semiconductor devices, Integrated circuit Parts 1 to 22
Publication 749 1984 Semiconductor Devices, Mechanical and
climatic test methods
Parts 1 to 36
IEC-60749-xx 2002-2004 Semiconductor devices
—Mechanical and climatic test methods
Parts 1 to 36
• Publication 68 individual standards
Number Title Established
68-1 Environmental testing, Part 1: General and guidance 1988
68-2 Part 2: Test Series 1973
68-2-1 Test A: Cold. Amendment No. 1 (1983), No. 2 (1994) 1990
68-2-2 Test B: Dry heat. Amendment No. 1 (1993), No. 2 (1994) 1974
68-2-3 Test Ca: Damp heat, steady state 1969
68-2-5 Test Sa: Simulated solar radiation at ground level 1975
68-2-6 Test Fc: Vibration (sinusoidal) 1995
68-2-7 Test Ga and guidance: Acceleration, steady state. Amendment
No. 1 (1986)
1983
68-2-9 Guidance for solar radiation testing. Amendment No. 1 (1984) 1975
68-2-10 Part 2: Test—Test J and guidance: Mould growth 1988
68-2-11 Test Ka: Salt mist 1981
68-2-13 Test M: Low air pressure 1983
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Number Title Established
68-2-14 Test N: Change of temperature. Amendment No. 1 (1986) 1984
68-2-17 Test Q: Sealing 1994
68-2-20 Test T: Soldering. Amendment No. 2 (1987) 1979
68-2-21 Test U: Robustness of terminations and integral mounting devices.
Amendment No. 2 (1991), No. 3 (1992)
1983
68-2-27 Part 2: Tests. Test Ea and Guidance: Shock 1987
68-2-28 Guidance for damp heat tests 1990
68-2-29 Part 2: Tests. Test Eb and Guidance: Bump 1987
68-2-30 Test Db and guidance: Damp heat, cyclic (12+12-hour cycle).
Amendment No. 1 (1985)
1980
68-2-31 Test Ec: Drop and topple, primarily for equipment type specimens.
Amendment No. 1 (1982)
1969
68-2-32 Test Ed: Free fall. Amendment No. 2 (1990) 1975
68-2-33 Guidance on change of temperature tests. Amendment No. 1 (1978) 1971
68-2-34 Test Fd: Random vibration wide band—General requirements.
Amendment No. 1 (1983)
1973
68-2-35 Test Fda: Random vibration wide band—Reproducibility High.
Amendment No. 1 (1983)
1973
68-2-36 Test Fdb: Random vibration wide band—Reproducibility Medium.
Amendment No. 1 (1983)
1973
68-2-37 Test Fdc: Random vibration wide band—Reproducibility Low.
Amendment No. 1 (1983)
1973
68-2-38 Test Z/AD: Composite temperature/humidity cycle test 1974
68-2-39 Test Z/AMD: Combined sequential cold, low air pressure, and damp
heat test
1976
68-2-40 Test Z/AMD: Combined cold/low air pressure tests. Amendment
No. 1 (1983)
1976
68-2-41 Test Z/BM: Combined dry heat/low air pressure tests. Amendment
No. 1 (1983)
1976
68-2-42 Test Kc: Sulphur dioxide test for contacts and connections 1982
68-2-43 Test Kd: Hydrogen sulphide test for contacts and connections 1976
68-2-44 Guidance on Test T: Soldering 1995
68-2-45 Test XA and guidance: Immersion in cleaning solvents. Amendment
No. 1 (1993)
1980
68-2-46 Guidance to Test Kd: Hydrogen sulphide test for contacts and
connections
1982
68-2-47 Mounting of components, equipment and other articles for dynamic
tests including shock (Ea), bump (Eb), vibration (Fc and Fd) and
steady-state acceleration (Ga) and guidance
1982
68-2-48 Guidance on the application of the tests of IEC 68 to simulate the
effects of storage
1982
68-2-49 Guidance to Test Kc: Sulphur dioxide test for contacts and
connections
1983
68-2-50 Test Z/AFc: Combined cold/vibration (sinusoidal) tests for both heatdissipating
and non-heat-dissipating specimens
1983
68-2-51 Test Z/BFc: Combined dry heat/vibration (sinusoidal) tests for both
heat-dissipating and non-heat-dissipating specimens
1983
68-2-52 Test Kb: Salt mist, cyclic (sodium chloride solution) 1984
68-2-53 Guidance to test Z/AFc and Z/BFc: Combined temperature (cold
and dry heat) and vibration (sinusoidal) tests
1984
68-2-54 Test Ta: Soldering. Solderbility testing by the wetting balance
method
1985
68-2-55 Test Ee and Guidance: Bounce 1987
68-2-56 Part 2: Tests. Test Cb: Damp heat, steady state, primarily for
equipment
1988
68-2-57 Test Ff: Vibration. Time-history method 1989
68-2-58 Test Td: Solderbility, resistance to dissolution of metallization and to
soldering heat of Surface Mounting Devices (SMD)
1989
68-2-59 Test Fe: Vibration—Sine-beat method 1990
68-2-60 Part 2: Tests—Test Ke: Flowing mixed gas corrosion test 1995
68-2-61 Test Z/ABDM: Climatic sequence 1991
68-2-62 Test Ef: Impact, pendulum hammer 1991
68-2-63 Test Eg: Impact, spring hammer 1991
68-2-64 Part 2: Test methods—Test Fh: Vibration broad-band random
(digital control) and guidance
1993
68-2-65 Part 2: Tests—Test Fg: Vibration, acoustically induced 1993
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Number Title Established
68-2-66 Part 2: Test methods—Test Cx: Damp heat, steady state
(unsaturated pressurized vapor)
1994
68-2-67 Part 2: Tests—Test Cy: Damp heat, steady state, accelerated test
primarily intended for components
1995
68-2-68 Part 2: Tests—Test L: Dust and sand 1994
68-2-69 Part 2: Tests—Test Te: Solderability testing of electronic
components for surface mount technology by the wetting balance
method
1995
68-2-70 Part 2: Tests—Test Xb: abrasion of markings and letterings caused
by rubbing of fingers and hands
1995
68-3-1 Part 3: Background information
Section One—Cold and dry heat tests
1974
68-3-1A First supplement 1978
68-3-2 Section Two—Combined temperature/low air pressure tests 1976
68-3-3 Part 3: Guidance. Seismic test methods for equipments 1991
68-4 Part 4: Information for specification writers—Test summaries.
Amendment No. 1 (1992). Amendment No. 2 (1994)
1987
68-5-1 Part 5: Guide to drafting of test methods—General principles 1991
68-5-2 Part 5: Guide to drafting of test methods—Terms and definitions 1990
• IEC-60749-xx individual standards
Number Title Established
IEC-60749-1 General 2003
IEC-60749-2 Low air pressure 2003
IEC-60749-3 External Visual examination 2003
IEC-60749-4 Damp heat, steady state, highly accelerated test (HAST) 2003
IEC-60749-5 Steady state temperature humidity bias life test 2003
IEC-60749-6 Storage at high temperature 2003
IEC-60749-8 Sealing 2003
IEC-60749-9 Permanence of marking 2003
IEC-60749-10 Mechanical Shock 2003
IEC-60749-11 Rapid change of temperature—Two-fluid-bath method 2003
IEC-60749-12 Vibration, variable frequency 2003
IEC-60749-13 Salt atmosphere 2003
IEC-60749-14 Robustness of terminations (lead integrity) 2003
IEC-60749-15 Resistance to soldering temperature for through-hole mounted
device
2003
IEC-60749-16 Particle impact noise detection (PIND) 2003
IEC-60749-17 Neutron irradiation 2003
IEC-60749-18 Ionizing radiation (total dose) 2002
IEC-60749-19 Die shear strength 2003
IEC-60749-20 Resistance of plastic-encapsulated SMDs to the combined effect
of moisture and soldering heat
2003
IEC-60749-21 Solderbility 2004
IEC-60749-22 Bond strength 2003
IEC-60749-23 High temperature operating life 2004
IEC-60749-24 Accelerated moisture resistance—Unbiased HAST 2004
IEC-60749-25 Temperature cycling 2003
IEC-60749-26 Electrostatic discharge (ESD) sensitivity testing—Human body
model (HBM)
2003
IEC-60749-27 Electrostatic discharge (ESD) sensitivity testing—Machine model
(MM)
2003
IEC-60749-29 Latch-up test 2003
IEC-60749-31 Flammability of plastic-encapsulated device (internally induced) 2003
IEC-60749-32 Flammability of plastic-encapsulated device (externally induced) 2003
IEC-60749-33 Accelerated moisture resistance—Unbiased autoclave 2004
IEC-60749-34 Power cycling 2004
IEC-60749-36 Acceleration, steady state 2003
Section 7 Standards and Certification Schemes for the Quality System, Safety, and Reliability of Semiconductor Devices
Rev. 1.00 Aug. 31, 2006 Page 343 of 410
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(4) MIL standards
Number Title Established
MIL-STD-202 Test Methods for Electronic and Electrical Component Parts 1980
MIL-STD-690 Failure Rate Sampling Plans and Procedures 1968
MIL-STD-750 Test Methods for Semiconductor Devices 1983
MIL-STD-790 Reliability Assurance Program for Electronic Parts Specifications 1968
MIL-STD-883 Test Methods and Procedures for Microelectronics 1983
MIL-M-38510 Microcircuits, General Specification 1981
MIL-M-55565 Microcircuits, Preparation for Delivery 1978
MIL-S-19500 Semiconductor Devices, General Specification 1977
Section 7 Standards and Certification Schemes for the Quality System, Safety, and Reliability of Semiconductor Devices
Rev. 1.00 Aug. 31, 2006 Page 344 of 410
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Appendix
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Appendix