一份msa报告引发的------

MSA Study

On Solder Paste Measurement System

Overall Objective

Equipment Engineering group will make a MSA study on current Solder paste Measurement system which will be used to collect key process parameter-Solder paste height and put into Auto SPC alarm later.


Project Background

SPC Chart of Solder paste height was dotted and controlled by manually, now Quality group contact IT to develop software to automatic dot SPC chart and alarm .


Measurement system:

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Team Member:

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MSA Process and Sample Plan

Before measurement, Equipment Engineer(Shw) use measurement machine operation to give 3 EE technicians training to make sure all measurement process in consistence.
10 Printing samples from current build line 7 of Modelare selected for study.(to reduce the time and environment factor impact on solder paste height, The 10 samples took from line7 as twice , each get 5 samples.)
PQA send the samples in random order to the first ope. to measure once to get blind sampling data according SOP, Location at U8

Have the 2nd and then the 3rd operators measure all the samples once in random order.

Repeat the last 2 steps and have 3 trials to get 3 reading for each PCB


Tree Diagram

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Model Observed Response = Operator + Part + Operator*Part + Response(error)


The measurement result are shown below:

Measurement characteristic: Solder Paste Height

Specification: 5mil

Tolerance: 4-8 mil (1mil=25.4/1000 mm)

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