工艺可靠性报告

Reliability Qualification Report
ZD32XX Charge Pump Based WLED Display Driver
Date: May 25, 2006
Prepared By: Calvin Lee
Revision: 1.0
ZYWYN CORPORATION
WLED Reliability Report 2 5/25/2006
Table of Contents Page
Life Test 3
Fit Rate Calculation 5
ESD Test 6
Temp Cycle Test 7
Appendix I
10-Pin MSOP 8
Package Information
Appendix II
SOT-26 9~16
Reliability Report
Appendix III
Photos of Test Equipment 17~18
Appendix IV
ESD Test Sequence 19~20
WLED Reliability Report 3 5/25/2006
Reliability Life Test Result
Life Test
Life Testing is performed to determine if device has any fundamental
reliability related failure mechanisms, which can be divided into 4 main
groups:
• Process or die related failures, such as oxide-related defects,
metallization-related defects and diffusion-related defects.
• Assembly-related defects such as wire bonding or package-related
failures.
• Design-related defects.
• Miscellaneous, undetermined or application-induced failures.
Life Test Result
Product Family: Charge Pump Based WLED Display Driver
Device Type: ZD3200/ZD3210/ZD3202/ZD3203/ZD3205
/ZD3213
Mask Sets: MS169/ MS180/ MS138/ MS173/ MS175
MS181
Process: Episil Mixed Mode 0.5μm 2 Poly-2Metal
CMOS Process
Wafer Manufacturer: Episil Technologies, Inc.
Package Type: 6-Pin TSOT23/8-Pin MSOP/10-Pin
MSOP/10-Pin DFN
Package Manufacturer: Lingsen Precision Industries, Ltd., Unisem
(M) Berhad
Die Attach Adhesive: CRM-1033BF
Bond Wire: NL5 1.0 mil
Test: HTOL 500 hrs, 3.3V Dynamic Burn-In
#125°C
Reference Standard: Mil-Std-883
Pass/Fail Criteria: Electrical QA testing to datasheet limits at
25°C before and after stress.