英文高手请进来试试!

表弟刚毕业到一个外企,部门经理拿一份PCB厂商稽清单,要他先了解,但其中很多术语不懂,希望有了解PCB制程的高手指点一下,先谢谢大家!!
关于制程能力

1.Range of Layer Count

2.Layer Count sweetspot

3.Max Aspect Ratio

4.Max Aspect Ratio

5.Min Line Width & Spacing (Outer Layer)

6.Min Line Width & Spacing (Inner Layer)

7.Min Impedance Control Tolerance (50-Ohm nominal)

8.Range of available Copper Weight (UL Approved)

9.Board finishes (other than HASL or Entek)

10.Maximum Warpage (%)

11.Smallest plated hole size (mechanical drill) & Tolerance

12.Is HDI, micro-via, build-up technology available ?

13.Smallest plated hole size (laser drill)

14.Numbers of laser drill machines

15.Laminate Materials (other than FR-4 135c Tg)

16.Solder resists other than LPI

17.Is pin lamination process available ?

18.Is sequential lamination available?

19.Is embedded or buried Capacitor / Resistor available ?

20.Percentage of products built with blind / buried via.

21.Percentage of revenue from backplane production.

22.Percentage of revenue for BGA substrates.

23.Telecordia GR-78 Certification?

24.Best turn-around-time for quick-turn production.

25.Is there a plan to qualify RoHS laminate materials

26.Provide a soft copy of IPC-1710.

关于产品技术

1.Does supplier have the ability to develop HDI or Microvia process?

2.Does the supplier consider there factory Bell core compliant?

3.Does supplier have the ability to build the Halogen-free product?

关于制程技术

1.'Does supplier have data to demonstrate the reliability of each microvia design type offered?

2.Does supplier have data to demonstrate capability to register microvia hole pattern to the underlying layers?

3.Do materials used in microvia construction appear on supplier's UL listing?

4.'Does supplier have the ability to plate the smallest microvias consistently and without voiding?show your evidence.

5.Are there a automation capability for the Plating, Vacuum Packing for final product, Optical Inspection, E-Test of boards?

6.Does supplier have the capability to auto-check the cosmetic by automatic machine?

关于坏品分析

1.Do procedures exist that define what to do in the event of test failures?

2.Is there a x-ray tester to test to test the Sn/Au/Ni/Ag etc? And please describe the test frequency and containment plan when x-ray is not work or other reason.

3.Is there a SEM/EDS to detect the contamination in your process or other quality issue at SMT site due to pcb issue?

4.Is there a RoHS analysis/XRF tester to check the restricted substances in your process at real time?

5.Is testing such as multiple solder float thermal stress testing done to verify plated through hole and via reliability?Is thermal stressing of microsections performed per IPC-TM-650, method 2.6.8?

6.Is solderability test being performed on all products & surface finishing? Describe your test method.

7.Is plated copper tensile strength and elongation being tested? If so, what is the test frequency

8.Is plated copper being test in the environmental test chamber? If so, what is the test frequency.

9.Do you perform the impedance test and your capability & frequency?please describe how to control impedance and retain the coupon sample.

10.Is there a board ionic contamination being tested? If so, what is the test frequency.