標準: IPC-7095B-2008
1 SCOPE
2 APPLICABLE DOCUMENTS
3 SELECTION CRITERIA AND MANAGING BGA IMPLEMENTATION
4 COMPONENT CONSIDERATIONS
5 PCBS AND OTHER MOUNTING STRUCTURES
6 PRINTED CIRCUIT ASSEMBLY DESIGN CONSIDERATION
7 ASSEMBLY OF BGAS ON PRINTED CIRCUIT BOARDS
8 RELIABILITY
9 DEFECT AND FAILURE ANALYSIS CASE STUDIES
10 GLOSSARY AND ACRONYMS
11 BIBLIOGRAPHY AND REFERENCES
(計4個檔案, 不是分卷壓縮, 而是因現實狀況進行手工切割的)
2 APPLICABLE DOCUMENTS
3 SELECTION CRITERIA AND MANAGING BGA IMPLEMENTATION
4 COMPONENT CONSIDERATIONS
5 PCBS AND OTHER MOUNTING STRUCTURES
6 PRINTED CIRCUIT ASSEMBLY DESIGN CONSIDERATION
7 ASSEMBLY OF BGAS ON PRINTED CIRCUIT BOARDS
8 RELIABILITY
9 DEFECT AND FAILURE ANALYSIS CASE STUDIES
10 GLOSSARY AND ACRONYMS
11 BIBLIOGRAPHY AND REFERENCES
(計4個檔案, 不是分卷壓縮, 而是因現實狀況進行手工切割的)
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wumingli1985
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