200808歐盟RoHS指令排除條款匯總（中英對照）

1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
2. 小型日光燈中的汞含量不得超過5毫克/燈；

1. Mercury in straight fluorescent lamps for general purposes not exceeding:

A. halophosphate 10 mg
B. triphosphate with normal lifetime 5 m
C. triphosphate with long lifetime 8 mg.g

1. 一般用途的直管日光燈中的汞含量不得超過：

A. 鹽磷酸鹽 10毫克
B. 一般型 三磷酸鹽 5毫克
C. 長效型 三磷酸鹽 8毫克
3.Mercury in straight fluorescent lamps for special purposes.

1. 特殊用途的直管日光燈中的汞含量；
2. Mercury in other lamps not specifically mentioned in this Annex.
3. 本附錄中未特別提及的其他照明燈中的汞含量

5.Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.

1. 陰極射線管、電子部件和發光管的玻璃內的鉛含量；

1. Lead as an alloying element in steel containing up to 0,35 % lead by weight, aluminium containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight.
2. 鋼中合金元素中的鉛含量達0.35%、鋁含量達0.4%，銅合金中的鉛含量達4%；

A. Lead in high melting temperature type solders (ie. Lead-based alloys containing 85% by weight or more lead.)
B. lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications,
C. lead in electronic ceramic parts (e.g. piezoelectrnoic devices).

A.高熔點類型的鉛焊料（以鉛為基礎的合金焊料，包含重量百分比85﹪或更高含量之焊料）。
B. 錫鉛焊料用於伺服器、儲存及儲存陣列系統、網路基礎設備之信號及開關、與發送功能相關之電信網路管理者。
C. 鉛用於電子陶瓷部分（例：壓電設備）

1. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC () amending Directive 76/769/EEC (*) relating to restrictions on the marketing and use of certain dangerous substances and preparations.
2. 根據修改關於限制特定危險物質和預製品銷售和使用的76/769/EEC(*)號指令的第91/338/EEC()號指令禁止以外的電觸點中的鎘及其化合物和鎘電鍍。

9.Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
A. ‘9a. DecaBDE in polymeric applications;’ 自2008.7.1取消豁免
B. ‘9b. Lead in lead-bronze bearing shells and bushes’.
9. 吸收式電冰箱中作為碳鋼冷卻系統防腐劑的六價鉻。
A. 第9a點：「十溴聯苯醚」(Deca BDE) 自2008.7.1取消豁免
B. 第9b點：「在鉛表銅軸承(lead-bronzebearing) 所使用的鉛」

10.Within the procedure referred to in Article 7(2), the Commission shall evaluate the applications for:
A. mercury in straight fluorescent lamps for special purposes,
B. light bulbs,

1. 根據在第7（2）條中提及的程序，歐盟委員會應評估以下方面的使用：

A. 特殊用途的直管日光燈中的汞；
B. 燈泡。

1. Lead used in compliant pin connector systems.
2. 插腳式連接器系統中的鉛。
3. Lead as a coating material for the thermal conduction module c-ring.

12.熱導模組C 環上的塗層材料的鉛。

1. Lead and cadmium in optical and filter glass.

13.光學玻璃和濾光玻璃中的鉛和鎘。
14.Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
14.鉛含量（以重量計）在80%到85%之間、連接插腳與微處理器封裝的含兩個元素以上的焊料中的鉛。
15.Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages. 15. 積體電路封裝(Flip Chips)內部之半導體印模與載體(carrier)合併，需焊接以達到電力接駁之鉛焊料使用
16.Lead in linear incandescent lamps with silicate coated tubes.
16.白熾燈管(硅酸鹽塗於燈管)所含的鉛。
17.Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for professional reprography applications.

1. 專業複印設備的高強度放電燈中作為發光劑的鉛鹵化物。
2. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi2O5:Pb) as well as when used as speciality lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba)2MgSi2O7:Pb).

18.當放電燈被用作含磷仿日曬燈（例如BSP）、或二氮化合物列印、平版印刷、捕蟲器，以及含磷化學和含磷食物加工過程的專業燈時（例如SMS），放電燈中的螢光粉觸媒劑的鉛（鉛含量1%以下）。

1. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL).
2. 緊縮節能燈中作為汞的特定成分中PbBiSn-H及PbInSn-Hg中的鉛以及作為輔助汞合金中PbSn-Hg中的鉛。

20.Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCD).’
20.液晶顯示器中焊接前後平版螢光燈基質的玻璃中的氧化鉛。

1. Lead and cadmium in printing inks for the application of enamels on borosilicate glass
2. 用於硼矽玻璃瓷漆的印刷油墨所含的鉛及鎘
3. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.)
4. 用於光纖通訊系統，以稀土鐵石榴石晶體製成的法拉第旋轉器中作為雜質的鉛
5. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames 23. 小螺距零件表面材料所含的鉛
6. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

24.通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛

1. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes
2. 等離子顯示屏(PDP)及表面傳導式電子發射顯示器 (SED)的構件所用的氧化鉛
3. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps
4. 藍黑燈管 (BLB)玻璃外罩所含的氧化鉛
5. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers
6. 在大功率揚聲器中作為轉換器焊料的鉛合金

28.Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC

1. 在第69/493/EEC號指令附件一第1、2、3及4分類定義下之水晶玻璃鉛
2. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more.
3. 使用於聲壓大於或等於100分貝的高功率音箱中的音圈轉換器上的電導體的電子或機械焊點中的鎘合金。
4. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting).
5. 於無汞平面螢光燈(使用於液晶顯示器、設計或工業照明設備)中焊錫內含的鉛。

1. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes
2. 封裝氬和氪雷射管的氧化鉛。

（財團法人塑膠工業技術發展中心 產業管理輔導組 譯,供參考用,如有疑問,請自行參照原始條文）