4. SAFE LAUNCH
4.1. Safe Launch Application
4.1.1. The safe launch should be used in the following situations.
• New product
• New Manufacturing facility, existing supplier
• Multiple Line qualification with existing product.
4.2. Yields/Gates
4.2.1. Process yield-gates and critical phase exit gates will be defined and documented for all Engineering Verification Tests and Manufacturing builds on Dell product. Supplier defines appropriate gates and yields goals; these will be reviewed and approved by Dell SE&Q / Engineering. Goals will not be changed without the agreement of the entire team and documented in the QMP.
4.2.2. Only First Pass Yields will be used for the safe launch process.
4.3. Applying Gates to Builds
4.3.1. The DELL SE&Q / Supplier will determine the gates based upon experience, supplier inputs, quality history and the quality requirements for the next higher assembly.
4.4. Safe Launch Gate Rules and Corrective Actions
4.4.1. In-process and after each build, each critical process results are evaluated vs. the established goals. A formal daily review of results will be completed after all builds for a minimum period of two weeks. The DELL SE&Q / JQE or GQAM will be present.
4.4.2. Violation of a gate: See process map in attachment 3.
4.4.3. Gates are achieved: See process map in attachment 3.
4.4.4. Exiting Safe Launch: Meets mass production goals for two week in a row. See process map in attachment 3.
4.5. Processes to be Monitored, Guidelines
4.5.1. The DELL SE&Q, JQE and/or GQAM will agree to a list of critical inspection points. This list will form the basis for Safe Launch measurement.
4.6. Build Quantity Guidelines
• Supplier Design Phases: 5-50 units based on phase.
• Trial Run: 100 units minimum.
• MVT: 1000 units minimum.
• Mass Pro: See ramp plan.
4.7. Data Collection/Reporting
4.7.1. The supplier is required to monitor each of the processes identified during each of the builds per the goals established. This can be completed through automated shop floor control systems or manual collection/reporting.
4.7.2. Safe Launch Data Collection Template and Action Plan Register - will be used for all builds. Reference Appendix X.
4.7.3. The supplier JQE will provide a daily summary report for each build immediately after it is completed through the safe launch period. It will contain all of the appropriate yields vs. goals, all issues identified and corrective action plans. See appendix X for complete data collection details.
4.8. Post Build meetings
4.8.1. The supplier is required to organize a daily post build meeting after every build. The JQE is responsible to provide post build findings to Dell GSQM.
4.9. New Product Readiness Review (Appendix Y)
4.9.1. Each Supplier manufacturing line will require a New Products Readiness Review prior to Mass Production. Any deficiencies that are found during the review will require the supplier to develop a corrective action plan, date to complete and person responsible. All CA’s will be closed and approved by the SE&Q prior to mass production.
4.9.2. For New Manufacturing Lines, the supplier will provide 30-day notification to the Dell SE&Q of any new manufacturing line that will be implemented. An NPRR will be required and closed prior to Mass Production.
4.10. Critical Parameters
4.10.1. Critical Parameter Listing (Appendix E)
Dell and the Supplier will identify the critical parameters for the specific product. The Supplier will provide a critical parameter test plan to the Dell SE&Q for approval prior to TR and finalized prior to MVT. The following are the minimum critical parameters that will be monitored see appendix E.
Panel Level (for LCD Display Product)
• View angle – supplier data
• Contrast ratio - supplier data
• Response time – supplier data
• Bright / Dead dots – supplier data
Will provide by vendor weekly
SMT/ PCBA Level
• Thickness of solder paste
• Temperature profile control (X bar-R) chart (reflow soldering, wave soldering)
• DC voltages for Power board
Assembly Level
• Color temperature
• FOS Parameters
• Power Consumption
4.10.2. Critical Parameters Quality Monitoring (Appendix E)
These product performance parameters are controlled once process capability has been established. Reference “Process Capability” section for requirements. Quality information will be submitted to the Dell SE&Q on a Weekly basis, see appendix E). Statistical variations will be reported, details include out of control situation, CA/PA responsibility and closure date.
4.11. Approved Vendor List (AVL, Subcontractors)
4.11.1. Approved Sub-Supplier Listing
The Supplier will provide the Dell SE&Q a listing of their components and Subcontractors/Sub-tier suppliers by to Phase C release.
4.11.2. Changes to the AVL
All AVL changes will be revision controlled and processed via the ECN/PCN process noted in this document. Changes cannot be made without Dell approval and notification.
4.12. Product Process Flows
4.12.1. The supplier will provide Dell a detailed product/process flow chart by phase C and finalized Prior to production release. This flow chart will identify all process form receiving inspection to final shipping. The requirements include the following. If the supplier is using PCBA subcontractors, a process flow chart will be provided to the Dell SE&Q for each subcontractor.
• Process flow by station • Operation performed
• Critical Parameters • Material Used
• Inspection Checkpoints • Control Points/Specifications
• Tools and/or Equipment • Inspection Methods
• Sampling plan or SPC type • Process owner
• Process control reaction procedures
4.12.2. Changes to the Product Process Flows
All Changes to the Product Process Flows will be revision controlled and processed via the ECN process noted in this document. Changes cannot be made without Dell approval and notification.
4.13. First Article Inspection
4.13.1. The supplier will provide a test plan for critical components, product level inspection and plastic/mechanical inspections prior to TR and production release. Suppliers are required to perform a First Article Inspection (FAI) to assure all products meet design-engineering parameters. FAI will be completed based on the following:
• New Product Introduction
• New Manufacturing facility/Site
• ECN/PCN as required by the Dell SE&Q on critical components
• As requested by the Dell GSQM
• Changes to Critical Components
• New Sub-Supplier/Sub-Supplier Site (change to the AVL)
• New tool/mold/dies, inclusive of duplication
• Major tooling or equipment refurbishment
• Relocated tooling or production equipment
• Revised or modified process flow or production sequence
• Changes in materials or material sources
• Product following a stop-ship order due to a quality issue
First Article Inspection may include verification of mechanical dimensions, chemical finishes, solder workmanship verification, configuration, and test data. A First Article inspection report is generated that defines the Supplier, part number, and revision. Included in this report is a list of inspection characteristics to be verified, either visually or through the use of standard inspection tools. Sample size must be of statistical significant. An inspector or quality engineer will perform the First Article. Final approval of the success of the First Article Inspection will be the responsibility of the Dell SE&Q. The supplier will submit FAI data to the Dell SE&Q for approval prior to production release. Approval will be given from the Dell SE&Q prior to the implementation.
4.13.2. Data for Critical Components
The purpose of the FAI is to verify compliance of a part produced in a normal production environment to the Supplier’s design specifications. Supplier to provide documented proof that critical components were inspected and meet Supplier design specifications.
4.13.3. Test Data at the Product Level
FAI will be performed using the latest revision design and product specification. FAI will be performed at the Supplier’s site or equivalent Dell approved configuration center. Each Manufacturing site will require product level FAI. Supplier to use validated test procedures/software to provide data that 1st pilot lot meets product specification.
4.13.4. Mechanical/Plastics
FAI will be performed using the latest revision design and product specification. FAI will be performed at the Supplier’s site or equivalent Dell approved configuration center. Each Manufacturing site will require product level FAI. Supplier to use validated test procedures/software to provide data that 1st pilot lot meets product specification.
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SiMtHeOnE (威望:5) (江苏 苏州) 电子制造 Supplier Quality Engineering
赞同来自: gaobo118560 、sutie 、Frank_736
4. SAFE LAUNCH
4.1. Safe Launch Application
4.1.1. The safe launch should be used in the following situations.
• New product
• New Manufacturing facility, existing supplier
• Multiple Line qualification with existing product.
4.2. Yields/Gates
4.2.1. Process yield-gates and critical phase exit gates will be defined and documented for all Engineering Verification Tests and Manufacturing builds on Dell product. Supplier defines appropriate gates and yields goals; these will be reviewed and approved by Dell SE&Q / Engineering. Goals will not be changed without the agreement of the entire team and documented in the QMP.
4.2.2. Only First Pass Yields will be used for the safe launch process.
4.3. Applying Gates to Builds
4.3.1. The DELL SE&Q / Supplier will determine the gates based upon experience, supplier inputs, quality history and the quality requirements for the next higher assembly.
4.4. Safe Launch Gate Rules and Corrective Actions
4.4.1. In-process and after each build, each critical process results are evaluated vs. the established goals. A formal daily review of results will be completed after all builds for a minimum period of two weeks. The DELL SE&Q / JQE or GQAM will be present.
4.4.2. Violation of a gate: See process map in attachment 3.
4.4.3. Gates are achieved: See process map in attachment 3.
4.4.4. Exiting Safe Launch: Meets mass production goals for two week in a row. See process map in attachment 3.
4.5. Processes to be Monitored, Guidelines
4.5.1. The DELL SE&Q, JQE and/or GQAM will agree to a list of critical inspection points. This list will form the basis for Safe Launch measurement.
4.6. Build Quantity Guidelines
• Supplier Design Phases: 5-50 units based on phase.
• Trial Run: 100 units minimum.
• MVT: 1000 units minimum.
• Mass Pro: See ramp plan.
4.7. Data Collection/Reporting
4.7.1. The supplier is required to monitor each of the processes identified during each of the builds per the goals established. This can be completed through automated shop floor control systems or manual collection/reporting.
4.7.2. Safe Launch Data Collection Template and Action Plan Register - will be used for all builds. Reference Appendix X.
4.7.3. The supplier JQE will provide a daily summary report for each build immediately after it is completed through the safe launch period. It will contain all of the appropriate yields vs. goals, all issues identified and corrective action plans. See appendix X for complete data collection details.
4.8. Post Build meetings
4.8.1. The supplier is required to organize a daily post build meeting after every build. The JQE is responsible to provide post build findings to Dell GSQM.
4.9. New Product Readiness Review (Appendix Y)
4.9.1. Each Supplier manufacturing line will require a New Products Readiness Review prior to Mass Production. Any deficiencies that are found during the review will require the supplier to develop a corrective action plan, date to complete and person responsible. All CA’s will be closed and approved by the SE&Q prior to mass production.
4.9.2. For New Manufacturing Lines, the supplier will provide 30-day notification to the Dell SE&Q of any new manufacturing line that will be implemented. An NPRR will be required and closed prior to Mass Production.
4.10. Critical Parameters
4.10.1. Critical Parameter Listing (Appendix E)
Dell and the Supplier will identify the critical parameters for the specific product. The Supplier will provide a critical parameter test plan to the Dell SE&Q for approval prior to TR and finalized prior to MVT. The following are the minimum critical parameters that will be monitored see appendix E.
Panel Level (for LCD Display Product)
• View angle – supplier data
• Contrast ratio - supplier data
• Response time – supplier data
• Bright / Dead dots – supplier data
Will provide by vendor weekly
SMT/ PCBA Level
• Thickness of solder paste
• Temperature profile control (X bar-R) chart (reflow soldering, wave soldering)
• DC voltages for Power board
Assembly Level
• Color temperature
• FOS Parameters
• Power Consumption
4.10.2. Critical Parameters Quality Monitoring (Appendix E)
These product performance parameters are controlled once process capability has been established. Reference “Process Capability” section for requirements. Quality information will be submitted to the Dell SE&Q on a Weekly basis, see appendix E). Statistical variations will be reported, details include out of control situation, CA/PA responsibility and closure date.
4.11. Approved Vendor List (AVL, Subcontractors)
4.11.1. Approved Sub-Supplier Listing
The Supplier will provide the Dell SE&Q a listing of their components and Subcontractors/Sub-tier suppliers by to Phase C release.
4.11.2. Changes to the AVL
All AVL changes will be revision controlled and processed via the ECN/PCN process noted in this document. Changes cannot be made without Dell approval and notification.
4.12. Product Process Flows
4.12.1. The supplier will provide Dell a detailed product/process flow chart by phase C and finalized Prior to production release. This flow chart will identify all process form receiving inspection to final shipping. The requirements include the following. If the supplier is using PCBA subcontractors, a process flow chart will be provided to the Dell SE&Q for each subcontractor.
• Process flow by station • Operation performed
• Critical Parameters • Material Used
• Inspection Checkpoints • Control Points/Specifications
• Tools and/or Equipment • Inspection Methods
• Sampling plan or SPC type • Process owner
• Process control reaction procedures
4.12.2. Changes to the Product Process Flows
All Changes to the Product Process Flows will be revision controlled and processed via the ECN process noted in this document. Changes cannot be made without Dell approval and notification.
4.13. First Article Inspection
4.13.1. The supplier will provide a test plan for critical components, product level inspection and plastic/mechanical inspections prior to TR and production release. Suppliers are required to perform a First Article Inspection (FAI) to assure all products meet design-engineering parameters. FAI will be completed based on the following:
• New Product Introduction
• New Manufacturing facility/Site
• ECN/PCN as required by the Dell SE&Q on critical components
• As requested by the Dell GSQM
• Changes to Critical Components
• New Sub-Supplier/Sub-Supplier Site (change to the AVL)
• New tool/mold/dies, inclusive of duplication
• Major tooling or equipment refurbishment
• Relocated tooling or production equipment
• Revised or modified process flow or production sequence
• Changes in materials or material sources
• Product following a stop-ship order due to a quality issue
First Article Inspection may include verification of mechanical dimensions, chemical finishes, solder workmanship verification, configuration, and test data. A First Article inspection report is generated that defines the Supplier, part number, and revision. Included in this report is a list of inspection characteristics to be verified, either visually or through the use of standard inspection tools. Sample size must be of statistical significant. An inspector or quality engineer will perform the First Article. Final approval of the success of the First Article Inspection will be the responsibility of the Dell SE&Q. The supplier will submit FAI data to the Dell SE&Q for approval prior to production release. Approval will be given from the Dell SE&Q prior to the implementation.
4.13.2. Data for Critical Components
The purpose of the FAI is to verify compliance of a part produced in a normal production environment to the Supplier’s design specifications. Supplier to provide documented proof that critical components were inspected and meet Supplier design specifications.
4.13.3. Test Data at the Product Level
FAI will be performed using the latest revision design and product specification. FAI will be performed at the Supplier’s site or equivalent Dell approved configuration center. Each Manufacturing site will require product level FAI. Supplier to use validated test procedures/software to provide data that 1st pilot lot meets product specification.
4.13.4. Mechanical/Plastics
FAI will be performed using the latest revision design and product specification. FAI will be performed at the Supplier’s site or equivalent Dell approved configuration center. Each Manufacturing site will require product level FAI. Supplier to use validated test procedures/software to provide data that 1st pilot lot meets product specification.