"Is there a pre-startup checklist for the preclean line? Is it current(completely filled in)?
针对预清洁线是否有建立预先点检表单？是否已经执行（已经填写）？"
"Is there objective evidence that the scrub/preclean chemistries are being analyzed by the laboratory on the documented frequency?
刷磨/预清洁化学药水是否有证据证明其有按照实验室文件规定的频率进行分析？
"
"Are Dump and Remake schedules documented for the preclean line and objective evidence exist that they are being adhered too?
是否有证据证明预清洗倾槽与更曹计划有符合文件要求？"
"Is there an evidence to demonstrate that all chemicals are monitored and controlled as listed in WI?
是否有证据证明所有的化学品与WI上管控的物质有监督并管控？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有制程上的WIP与相应制定材料是否管控在制定的工作区内？"
"Is a water break test performed every shift to ensure quality of pre-clean?
槽液测试是否每班测试一次以确保预清洁品质良好？"
"Is their positive air pressure from the cleanroom at the preclean line entrance into the cleanroom?
无尘室的预清洁线入口到无尘室是否有良好的压力？"
Imaging 干膜
"Is the cleanroom well controlled by temperature, humidity and particles which meet 10K Max. requirement and out of control notification? Review objective evidence.
无尘室的温度，湿度与尘埃粒子是否按照10K最高要求管控，并且有管控实效通知系统？
审核客观证据."
"Are the resist lamination and exposure areas in the cleanroom utilizing yellow lighting and do all exterior windows have UV blocking film?
无尘室的压膜与曝光区是否用的是黄灯并且所有的外部窗户使用的是UV膜？"
"Is there objective evidence to demonstrate that all dry films and/or liquid resist are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否有证据可以证明干膜或是湿膜储存在温度与湿度管控的环境内？并且，到期管控有先进先出目录？"
"Are there tacky roller clean machines in front of the laminator?
在压膜前是否有粘尘滚轮清洁机器？"
"For dry film lamination, is the temperature of the lamination roller checked and verified using an infrared meter?
针对干膜压膜，是否检查了压膜滚轮的温度并使用红外线表进行确认？"
"Is there a documented resist inspection criteria with pass/fail guidelines?
是否有文件规定的干膜检验标准指导书以判定接受或判退？"
"Is all in-process WIP and materials properly identified and controlled in designate area? Including expiration date on age sensitive material?
所有的制程WIP与材料是否有相应的定义并管控在制定区域？包括老化敏感材料有效期过期？"
"Is there a documented resist strip/rework procedure with the maximum number of reworks identified?
是否有文件规定干膜剥膜/重工程序有定义最大的重工次数？"
"For dry film lamination, is the temperature of the lamination roller checked and verified using an infrared meter?
对干膜压膜，是否有对压膜滚轮温度进行检验并对红外线表表进行确认？"
"Is there a latest revision control on working film?
是否对工作菲林的最新版本进行管控？"
"Is there an evidence that a maximum number of exposures has been established and the number of exposure times of working film is monitored?
是否有证据表明管控了曝光的最大次数并对工作菲林曝光次数进行监控？"
"Is the artwork cleaned after defined exposure times using tacky roller? Review the condition of the tacky rollers.
在确定曝光次数后，是否使用粘尘滚轮对底片进行清洁？审核粘尘滚轮的状况？"
"Are there tools and procedures with tolerance limits in place for front-to-back registration verification during the artwork setup? Is it identified as a critical SPC parameter?
在底片设计阶段，是否确认了前后对准度的工具/制程最大公差？是否被定义为关键SPC参数？"
" Is the front to back verified during this process?
在这些制程是否对上下对准度进行确认？"
"Is the maximum number of permissible exposures documented with a system to track the number of exposures?
可允许的最大曝光次数是否有文件规定并有相应的系统对其跟踪？"
"Is there an evidence that the number of exposure times of working film is monitored and the artwork is not being used beyond documented useful life?
是否能证明菲林的曝光次数有进行监控并且底片没有超出文件规定的使用期限？"
" Is the max holding time between expose and develop documented and followed?
曝光和显影之间是否文件规定最大的静置时间并有按照此要求执行？"
"Is their a pre-startup checklist for the DES line? Is it current(completely filled in)?
DES 线是否有预启动点检表？是否已经进行（有完整地填写）？"
"Is there an evidence to demonstrate that all chemicals are monitored and controlled as listed in WI?
是否能证明所有的化学品有进行监控并有管控WI清单？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有的制程上WIP与材料是否有定义并管控在指定的区域？"
"Are defectives and rework schedules documented for the DES line and objective evidence exist that they are being follow?
DES线是否有文件规定不良品与重工计划，并且有客观证据说明有按照其要求执行？"
"Is a first article run prior to etching the lot to confirm etcher settings and linewidths?
在批量蚀刻前是否先进行首件确认，以保证蚀刻机设备与线径？"
"Is the etch unifomity monitored at least monthly and records maintained as a quality document?
是否至少定期稽核一次蚀刻站并有相应的维护记录作为品质文件？"
"Are the etcher conveyor speeds defined and documented by copper weight/thickness?
蚀刻机运作速度是否有规定并且有文件规定铜重量/厚度？"
"Is the filtration system adequate? What's the clean frequency and renew frequency?
过滤系统是否完善？清洁频率与更换频率是多少？"
"Are there documented maximum final rinse water contamination levels, rinse flow rates and are these verified by conductivity measurements?
是否有文件规定最大水洗污染水准，水洗流动率与对传导性进行确认？"
"Are the cores observed coming off the DES line clean, dry and stain free?
是否有专门的对DES线清洁，烘干与无沾污进行检验？"
"Does the stripping module contain a filtering system for the removal of the dry film resist?
剥膜机是否有过滤系统以去除干膜膜屑？"
"Are seperators used to separate each core (signals & power/grounds) to prevent scratches?
是否有作业员单独操作每个重要项目（信号，电能，地面）以防止刮伤？"
"Are there identified schedule of cleaning the seperaors?
是否规定作业员的清洁计划？"
"Is there a system in place to identify which linewidths to be measured on a core?
现场是否有系统规定主要测试哪条线径？"
"Are linewidth measurement frequency documented and is the frequency at a minimum of the first core, middle and last core off the line in the lot?
是否有文件规定线径测试的频率？"
Subsection scores部分得分
Section 6 - AOI of innerlayer 外层AOI
"Is AOI perform 100% inspection for all signal layers?
所有層數是否100%进行AOI检测？"
"Are all WIP properly identified and place in the desinated area?
所有的WIP是否有相应的规定并放置在指定的区域？"
"Are the power / ground layer inspected per historical statistics sampling plan?
是否对能源/接地层进行检验并按照抽样计划定期统计？"
"Are the AOI programs data base on customer's data and are all the critical AOI settings and programs established by Engineering?
是否根据客户资料制定AOI程序，并且由工程建立所与的AOI关键参数设备与程序？"
"Does the AOI program have appropriate parameters programed to cover minimum linewidths, minimum spacing, dishdowns, etc?
AOI程序是否有相应的参数，其涉及到最小线径，最小间距，等？"
"Is a standard defect board used to verify each AOI machine is catching all defects at the beginning of each shift?
是否有不良标准板用于确认每台AOI机是否能够在开始每批测试前测出所有的不良？"
"Is there a system in place to notify the Image Area for first articles with repeat defects?
现场是否系统要求干膜首件发现重复不良时作出相应的通知？"
"If excess random defects are detected on a lot is this information immediately fed back to the DES operation for review and action? i.e. excess copper, nicks, shorts, opens?
若一批内出现了各种不良，此信息是否立即反馈给DES作业员并审核其作业动作？例如：残铜，线路缺口，短路，断路？"
"Is the AOI defect verification performed on separate verification stations and defect data collected and reported in a meaningful manner?
AOI不良确认是否有独立的确认站并且有收集不良资料并进行有意义的报告？"
"Are repaired panels re-AOI to confirm all defects were found and repaired?
修补后的板子是否有重新过AOI确认找出的不良已经全部修补OK？"
"Are yields tracked daily at AOI and feedback loop to I/L process improvement team established? Are first pass yield and final yield targets defined?
AOI站的产率是否每日进行跟踪并及时反馈给I/L制程建立相应的改善小组？是否对直通率与最终生产率目标进行定义？"
"Are corrective actions taken if yields fall below target?
若产量低于目标，是否采取相应的改善措施？"
"Is pareto analysis used to determine the top defects? Is effective continuous improvement used to eliminate top defects?
是否针对最高不良项目有要求使用柏拉图进行分析？是否采取持续有效的改善方法以减少最高不良？"
"Does the rework instruction comply with Synaptics Spec and IPC specification?
重工指导书是否符合synaptics规格与IPC规范？"
"Is there clear instruction to scrap the parts if more than three open circuit found at rework?
是否有明确的说明若重工时超过3条线路断路，则报废？"
"Is the tape test and resistance measurement performed on the welded traces to ensure the reliability of repair?
是否针对已经焊接的线路进行胶带测试，以确保修补板的信赖性？"
Subsection scores部分得分
Section 7 - Lamination 压合
"Is there evidence exist that the Oxide Chemistry supplier has audited the line in the previous three months? If so, were actions taken?
是否能证明棕化药水供应商在3个月前有对棕化线进行稽核？若有这样做，是否采取了相应的措施？"
"Have DOEs been conducted to verify the optimum oxide thickness to ensure no delamination after thermal stress test?
是否有进行DOE确保最好的棕化厚度以保证在热压测试制程发生分层？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的地方？"
"Is the microetch rate monitored? Is it under SPC control with calculated control limits and are the charts & actions current?
是否对微蚀率进行监控？其是否有SPC图管控并有正在进行的措施？"
"Are oxide bond strength test performed for all material types for each oxide line used on Synaptics Product on a weekly basis?
氧化粘合强度测试是否针对synaptica产品的所有材料类型的每条线每周进行一次测试？"
"Are the oxide chemistries on a auto-dosing system?
棕化药水是否有定量给料系统？"
"Is DI water used for rinses?
是否使用DI水进行水洗？"
Are the cores exiting the machine dry and stain free? 机器是否干燥并无污染？
"Is there an evidence that black oxide thickness is well controlled?
是否能证明黑化厚度有很好的管控？"
"Are the oxided panels uniform in color, appearance and free of scratches/handling damage?
氧化板是否颜色统一，外表无刮伤/或操作导致损坏？"
"Is ionic contamination test conducted once/shift as defined in the Synaptics specification?
离子污染测试是否按照synaptics规范要求每次换班执行一次？"
"Are cores reworked at oxide? If so, is there a documented rework procedure with the maximum number of reworks established?
氧化线是否重工？若有重工，是否有文件规定最大重工次数？"
"Is the lay-up done in a clean room with adequate temperature and humidity control?
叠合线无尘室是否有相应的温度与湿度管控？"
"Are there established hold-times for oxide cores in tha layup operation?
是否规定氧化线-叠合作业的静置时间？ "
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的地方？"
"Is there a procedure in place to insure the stack-up is performed per layup provided and approved by Synaptics?
现场是否有文件以确保每对预叠有按照synaptics承认的要求执行？"
"Is the material profile done regularly to ensure the actual cooldown rate not exceed 5 deg C / minute? What is the heat rise and cool down rate?
是否定期检查以确保实际降温率不超过5度/分？温度升温与降温速率是多少？"
"Are steel plates cleaned for each cycle and polished periodically? Is the thickness of the steel plate checked regularly?
每批钢板是否定期清洁并打磨？钢板的厚度是否定期检查其厚度？"
"Is there an evidence that lamination press platen flatness/parallelism is checked a minimum of once/six months?
是否能证明压合平台是否平整/平行并至少1-6个月检查一次？"
"Is board thickness measured after lamination on all panels or on appropriate sample size at a min 5 points on each panel?
压合后的板厚是否进行抽樣检验, 对每PNL至少检验的5个点？"
"Is there X-ray punch with accuracy compensation design for registration control?
X-RAY冲床是否管控对准度的设计补偿精确度？"
"Is there a documented quality inspection procedure for resin spots on laminated panels?
是否有品质检验程序文件对压合板数脂沾污进行定义？"
"Is the Tg and delta Tg checked weekly for all material types used for Synaptics product on each lamination press?
所有用于synaptics型号的板材，是否每周对压合产品检测一次TG与△TG？"
"Does there exist a documented accept/reject criteria at pre-drill x-ray for misregistration?
是否有文件规定X-RAY钻孔对准度的接受/判退标准？"
"Is there a documented routine dimensional measurement confirmation performed on the x-ray pre-drill measurement system?
是否有文件定义对X-RAY钻孔系统进行尺寸测量确认？"
Subsection scores部分得分
Section 8 - Drilling 钻孔
"Does the drilling machine have broken bit and wrong bit size detection capability?
钻孔机是否有破损钻咀与不良钻咀尺寸鉴定能力？"
"Does the traveller clearly define all the drilling parameters including stack height?
钻孔机是否能够清楚地定义钻孔参数，包括堆叠厚度？"
"Is the drilling program checked prior to being released for production?
是否在开始生产国产前，对钻孔程序进行检验？"
"Is there evidence to demonstrate that spindle run-out is well controlled?
是否能证明钻轴偏移管控良好？"
"Is the stack height, maximum hit per drill bit, and feeds and speeds as a function of laminate type, board thickness, layer count and hole size controlled properly?
堆叠高度，每钻咀的最大钻次，进刀速度是否对板材类型，板厚，曾数，与孔尺寸进行管控？"
"Are drill bit registration checked by cross-section or X-ray? What is the frequency?
是否通过切片或X-RAY对钻咀对准度进行检验？频率是多少？"
"Do action plans exist for investigating and reducing broken bits? Does objective evidence exist that this is in control?
是否对钻咀破损有调查改善计划并减少了不良次数？是否有客观证据证明已经有管控此项？"
"Is there a documented drill rework/repair procedure with quality checks?
是否有文件规定钻孔重工/修补程序并有相关品质点检表？"
"Are PCB's with missing holes placed back on the drill machine and drilled?
所有PCB漏钻孔位于钻孔机台面上已经钻过的位置？"
"Are resharpened drill bit inspected and identified prior to use?
再次研磨的钻咀是否在使用前进行检验与确认？"
"Are the maximum number of re-sharpens documented & controlled?
是否有文件规定并对最大研磨次数进行管控？"
"Are Aluminum plates inspected for dents and scratches before use?
在使用之前是否对铝板进行检验，以确保无凹陷与刮伤？"
"Are output boards at the bottom of each spindle inspected on the hole size & location, hole registration and hole quantity etc?
每轴底部的板子是否检验其孔尺寸，孔位，孔对准度与孔数量等？"
"Is there a general inspection procedure with Drilling accuracy, Hole size, Hole quantity, Hole location and Copper surface appearance defined?
对钻孔精确度，孔径，孔数量，孔位与铜箔表面确认，是否有相应的检验程序？"
"Are drill machines capability data for hole position accuracy traceable for each machine and spindle?
钻孔机孔位对准度能力数据是否对每台机器/每轴进行跟踪？"
"Are drill machines capability data for runout traceable for each machine and spindle?
钻孔机偏移度是否追踪到每台机器/每轴？
"
"Is registration monitored by Perfect Test machine or X-ray check after Drilling?
在钻孔后是否通过良品测试机器或X-RAY检验其对准度？"
"Is SPC used in Drilling process?
钻孔制程是否使用SPC？"
"Are all passed/rejected boards properly labeled and segregated to avoid mixing or missing?
所有的PASS/REJECT板是否贴有相应的标签以避免混料或遗失？"
"Does all in process WIP and materials be properly identified and controlled?
所有的WIP制程是否有相应的定义并进行管控？"
"Is there a SPC control implemented and control chart updated for critical parameters?
是否有SPC管控并有最近更新关键参数管控？"
"Are relevant corrective actions taken toward all the out of control points?
所有超出管控的项目是否有相应的改善对策？"
Subsection scores部分得分
Section 9 - Electroless 化学沉铜
"Is there a pre-startup checklist for the Deburr line? Is it current(completely filled in)?
去毛刺线是否有启动前点检表？是否已经运行（完整填写）？"
"Are there air knives, fluid heads & ultrasonics on the deburr machine?
去毛刺机器是否有风刀，流动性&超声波？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Is a hole inspection/checker used after deburr for plugged holes? If so, are the data used for continuous improvement activities.
在去冲孔孔内毛刺后，是否检验孔？若有，是否有持续改善的资料？"
"Are the surface of the boards and holes completely dry after deburr process?
去毛刺后，板面与孔是否完全干燥？"
"Is there a pre-startup checklist for the Desmear line? Is it current?
去毛刺线是否有开机点检表？目前是否运行？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Are the temperatures, pumps, bath condition, tanks/sumps and process times on the line within the process specifications?
生产线上的温度，抽水机，槽液条件等是否管控在制程规范内？"
"Is there an evidence that chemical analysis is performed periodically?
是否能证明化学药水分析有定期完成？"
"Is there a pre-startup checklist for the electroless line? Is it current (completely filled in)?
化学沉铜线是否有开机点检表？目前是否运行（完整填写）？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Is backlight inspection performed to check the coverage of the electroless copper including both sides of the hole?
是否检查化学沉铜的孔两面的背光？"
"Is dummy-plating performed as part of the start-up procedure before electroless copper plating product?
化学沉铜在开始生产前是否有进行是试镀？"
"Is there a documented quality conformance procedure with accept/reject criteria for electroless plating line malfuctions(hoist, time, temperature, etc. interuptions) to insure the quality of the product in the line at the time of malfunction?
化学沉铜线生产是否有规定的品质确认程序的判定接受/判退标准。（提升，时间，温度，等）以确保线上的生产品质？"
"Is there an active continuous improvement team for plating voids in the electroless copper operation?
化学沉铜是否对电镀空洞有积极的持续改善小组？"
"Is SPC used for Desmear and Electroless process ? Is the corrective action taken for the out of control status?
去胶渣与化学沉铜制程是否使用SPC？ 超出管控要求时，是否采取相应的改善措施？"
"Are the plating current and programs used documented on traveler?
天车电镀电流与程序是否有规定的文件？"
"Is incoming water tested with PH and organics?
新增加水是否测试PH与有机物？"
"Is the contamination of the plating tank monitored regularly?
电镀槽污染是否定期进行监控？"
"Is vibration used? How often is the vibration checked?
是否对其搅拌？搅拌确认频率是多少？"
"Are filters managed properly? Clean frequency, renew frequency?
过滤器管控是否恰当？清洁频率，更新频率是多少？"
"Is there an established carbon treatment schedule with a maximum frequency of treating each plating tank every six months?
每个电镀槽最大处理频率为每6个月一次，是否建立碳处理计划？"
"Are cross-sections performed as an in-process plating control?
制程电镀管控是否有进行切片确认？"
"Is there a documented quality conformance procedure with accept/reject criteria for plating line malfuctions(hoist, time, temperature, etc. interuptions) to insure the quality of the product in the press?
电镀线生产是否有规定的品质确认程序的判定接受/判退标准。（提升，时间，温度，等）以确保线上的生产品质？"
"Are plating distributions performed on each plating tank on a monthly basis?
是否每月进行一次电镀槽药液添加？"
"Is there a documented allowable rework procedure with appropriate quality checks?
相应品质检验是否有文件规定允许重工？"
"If product is reworked, is the rework documented on the traveler, and does the reworked product receive appropriate re-inspection and testing?
若产品重工，是否有重工文件规定，并且有重工品再次检验时相应的接受标准？"
Subsection scores部分得分
Section 10 - Outerlayer 外层
"Is there a pre-startup checklist for the preclean line? Is it current(completely filled in)?
前处理线启动时是否有点检表？是否已经运行（填写完整）？"
"Is there objective evidence that the scrub/preclean chemistries are being analyzed by the laboratory on the documented frequency?
是否能证明有文件规定实验室有对刷磨/前处理化学药水分析，并规定其分析频率？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有制程WIP与材料是否有相应的定义并管控在指定的区域？"
"Are the panels as observed coming off the preclean line clean, dry and stain free?
前处理后，是否观察板面有清洁度，干燥度与无污染？"
"Is the cleanroom well controlled by temperature, humidity and particles which meet 10K Max. requirement and out of control notification? Review objective evidence.
无尘室的温度，湿度，尘埃粒子是否管控良好，其符合10K最高要求，并且，超过规格时有相应通知？审核客观证据。"
"Is the cleanroom positive pressure monitored on a regular basis with alarms for out of control notification?
无尘室压力是否管控良好并且当超过管控范围时有报警系统？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有制程WIP与材料是否有相应的定义并管控在指定的区域？"
"Are the resist lamination and exposure areas in the cleanroom utilizing yellow lighting and do all exterior windows have UV blocking film?
无尘室的压膜与曝光区是否用的是黄灯并且所有的外部窗户使用的是UV膜？"
"Is there objective evidence to demonstrate that all dry films and/or liquid resist are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否能够证明所有的干膜/或湿膜均管控在相应的温度/湿度范围之内？
并且，有先进先出过期日期管控目录？"
"Is the temperature of the PCB panel/ lamination roller checked and verified using the infrared meter at the entrance to the dry film laminator?
是否在进行干膜压膜时，对PCB温度/压合滚轮进行红外线确认？"
"Is there inspection criteria applied for dry film lamination with documented pass/fail criteria? (eg, bubble, tension force)
干膜压膜是否有规定的检验标准以判定PASS/Fail？（例如：气泡，张力）"
"Are resist defective panels due to the lamination or coating process fully exposed before resist removal i.e. stripped?
压膜或涂布制程在去膜前的不良板是否在去膜前（例如：剥膜）完全曝光？"
"Is the artwork cleaned after defined exposure times using tacky roller? Review the condition of the tacky rollers.
在确定曝光次数后是否使用粘尘滚轮对底片进行清洁？审核清洁滚轮状况？"
"Are first articles processed through Outerlayer Develop & AOI prior to exposing the remainder of the lot? Is the front to back verified during this process?
在批量之前，是否对外层显影或AOI进行首件确认？此制程是否校准上下对准度？"
"Is the front-to-back registration on layers measured and controlled?
是否测试并管控层间上下对准度？"
"Is the maximum number of permissible exposures documented with a system to track the number of exposures?
可允许的最大曝光次数是否有文件规定并有系统对曝光次数进行跟踪？"
"Is the artwork segregated and destroyed after the maximum number of exposures have been reached?
当底片达到最大曝光次数后是否隔离并处理掉 ？"
" Is the max holding time between expose and develop documented and followed?
曝光与显影之间的静置时间是否有文件规定并有按照其要求执行？"
"Is there a pre-startup checklist for the develop line? Is it current(completely filled in)?
显影线是否有启动前有点检表？目前是否已经执行（完整的填写）？"
"Is a first article run prior to developing the lot to confirm developer settings and linewidths?
是否在批量显影前做首件以确认显影设备与线径？"
"Are there documented maximum final rinse water contamination levels, rinse flow rates and are these verified by conductivity measurements?
是否有文件规定最大最终水洗污染水准，水流率与传导性测试？"
"Are the panels observed coming off the developer line clean, dry and stain free?
显影线后是否对板面检查清洁度，干燥度，与无污染度？"
"Is there a system in place to identify the linewidths to be measured on a panel?
现场是否有系统对板面线径进行测量？"
"Are all repaired boards identified for traceability?
所有的修补板是否有规定并可以追踪？"
"Is there a documented maximum hold time for panels with laminated photoresist before copper plating
是否有文件规定干膜压膜到镀铜之间的最大静置时间？"
Subsection scores部分得分
Section 11 - AOI of Outerlayer 外层AOI
"Is 100% AOI performed on outlayer? If No, what's the sample size?
外层是否100%进行AOI？若没有，抽样频率是多少？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Is there a system in place to notify the Image Area for first articles with repeat defects?
当影像转移区首件重复发现不良时是否有通知系统？"
"Is the AOI defect verification performed on separate verification stations and defect data collected and reported in a meaningful manner?
AOI不良确认是否有独立的确认站，收集不良数量并进行有意义的报告？"
"Is there a documented procedure identifing the maximum number of repairs allowed, including but not limited too welding opens, cutting out shorts and excess copper spots, etc?
是否有文件规定允许修补的最大次数，包括但不限于OPEN焊接，处理短路或残铜等？"
"Is there a set limit of no. of failure that the lot should reviewed by a MRB team?
是否设置不良數量限定，以使MRB小组审核？"
"Are repaired panels re-AOI to confirm all defects were found and repaired?
修补的板子是否重新过AOI以确认所有的不良是否已经找到并修补？"
"Are all repaired boards identified for traceability?
修补的板子是否可以确定其跟踪性？"
"Are yields tracked daily at AOI and feedback loop to O/L process improvement team established? Are first pass yield and final yield targets defined?
AOI站生产率是否每天进行跟踪ing反馈给建立的品质改善小组？是否对直通率与最终达成率进行定义？"
"Are corrective actions taken if yields fall below target?
若生产率低于目标是否采取改善措施？"
"Is golden boards used to check the AOI machine before the inspection of each shift?
在每次换班前是否用AOI机器检验镀金板？"
"Is prateo analysis used to determine the top defects? Is effective continuous improvement used to eliminate top defects?
针对已经确定的最高不良项目是否有柏拉图进行分析？是否使用有效的改善对策以减少不良？"
"Does the rework instruction specify welding conditions and number of welds? For Synaptics product is this procedure defined based on IPC-7721 ?
重工指导书是否规定焊接条件与焊接次数？Synaptics产品是否根据IPC-7721定义？"
"Is the tape test and resistance measurement performed on the welded traces to ensure the reliability of repair? Is there any controlled for the number of welds?
是否对焊接处进行胶带测试或阻抗测试以确保修补后的信赖性？焊接次数是否有管控？"
Subsection scores部分得分
Section 12 - Plating 电镀
"Is there a pre-startup checklist for the electrolytic copper plating line? Is it current(completely filled in)?
电镀制程启动是否有点检表？是否已经执行（完整的填写）？"
"Do the plating current and program used match the design and traveler? What is the ASF range used during plating? Who determines ASF? How?
电镀电流与程序是否符合设计要求？电镀时的ASF范围是多少？谁确定ASF？如何确认？"
"Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？"
"Is dummy-plating performed as part of the start-up procedure before plating product?
在电镀前是否作为启动程序执行试镀？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Is all chemistry utilizing (DI) water?
化学药水是否使用DI水？"
"Is their an estblished schedule for the anode, buss bars and cables maintenance? Is it current?
是否建立阳极，电镀条鱼电缆的维护计划？是否已经运行？"
"Is the filter bag cleaned and checked periodically to ensure no plugging and broken?
是否定期对过滤袋进行清洁与检验以确保无堵塞于破损？"
"Is there an established carbon treatment schedule with a maximum frequency of treating each plating tank every six months?
是否建立碳处理计划并确定其频率最大为每个电镀槽每6个月进行一次？"
"Is PTH and small via hole wall quality checked by cross-section and followed by a closed loop corrective action?
是否通过切片检验PTH与小导通孔孔壁状况，并有相应的改善对策跟踪？"
"Is the specification for copper thickness documented on the traveler and other quality documents?
铜厚是否有规定的规范？"
"Is there a feedback loop to pre-production engineering to provide hole size data to insure the hole sizes are centered on nominal and have a good Cpk?
前工程提供的孔径是否有相应的反馈跟踪以确保孔径的中心值正常并有很好的CPK？"
"Are plating distributions performed each plating tank on a monthly basis?
每个电镀槽是否每月进行药水添加？"
"Are thermal stressed cross-sections performed as an in-process plating control?
制程电镀管控是否有热应力切片试验？"
"Is there an evidence that expiration date of all wet materials are well controlled?
是否能证明所有的潮湿材料的过期日期有很好的管控？"
"Is there an evidence that plated through hole reliability testing is conducted on periodic basis that meets the requirements in SYNA specification?
是否能证明孔德信赖性测试由定期执行以符合syna规范要求？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定可以重工的程序与相应的品质检验要求？"
"If product is reworked, is the rework documented on the traveler, and does the reworked product receive appropriate re-inspection and testing?
若产品重工，是否有相应的重工文件并且重工品有接受相应的再次检验与测试？"
"Are Dump and Remake schedules documented for the strip-etch-strip and objective evidence exist that they are being adhered too?
报废与重工计划是否规定要求有 剥膜-蚀刻-剥膜的客观证据？"
"Is their a manifold nozzle layout & conveyor schedule available and is it used to validate correct equipment setup?
是否有喷嘴设计图/转运计划并且其用于改善设备布局？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is the filtration system adequate? What's the clean frequency and renew frequency?
过滤系统是否完善？其清洁频率与更新频率是多少？"
"Is a first article run prior to etching the lot to confirm etcher settings and linewidths?
在批量蚀刻前是否进行首件与确认蚀刻机设备与线径？"
"Are there documented maximum final rinse water contamination levels, rinse flow rates and are these verified by conductivity measurements?
是否有文件规定最大水洗污染水准？"
"Are slip sheets used to separate each panel to prevent scratches?
每片板之间是否有分隔胶片以避免刮伤？"
"Is there a system in place to identify the linewidths to be measured on a panel?
是否有系统要求对线径的测量进行定义？"
"Are fine pitch SMT pad size measured and SPC utilized?
SMT PAD 是否测试其节距并适用SPC进行管控？"
"Are the panels observed coming off the SES line clean, dry and stain free?
板子从SES线下来后，是否检验清洁度，烘干度与无污染？"
Subsection scores部分得分
Section 13 - Gold Plating 镀金
"Is their a pre-startup checklist for the preclean lines? Is it current(completely filled in)?
前处理线是否有启动点检表？是否已经运行（完整的填写）？"
"Is there objective evidence that the preclean chemistries are being analyzed by the laboratory on the documented frequency?
是否能证明前处理化学药水有被化验室按照文件要求的频率进行分析？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有的在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is there a documented process for select the plating current or program to match the different Gold and Nickel thickness?
是否有文件规定电镀电流或要求符合不同的电镀金厚？"
"Does the spray nozzle checked before each shift operation?
在每班转班前是否检查喷嘴？"
"Is there an evidence to demonstrate that the PCB surface cleanliness is monitored and controlled? Water break test?
是否能证明PCB表面清洁状况有进行监控与管控？是否有水不良测试？"
"Is a first article setup panel run to confirm process parameter to insure meeting nickel and gold thickness and other quality parameters before processing the remainder of the lot?
在开始量产前是否运作首件以确保制程参数，保证其符合镍和金厚等其他品质参数？"
"Is there a documented quality conformance procedure with accept/reject criteria for gold plating line malfuctions(chemistries out of spec. time, temperature, etc. interuptions) to insure the quality of the product in the plating line?
是否有品质合格品程序文件规定镀金板的接受与判退标准。（化学药水，时间，温度等超出规格），以确保电镀线品质标准？"
"Does the traveler or other process documentation specify the Nickel/Gold thickness ?
是否有文件规定镍金厚度？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定允许的重工程序和相应的品质检验？"
"Is the tape test performed to make sure the adhesion of gold plating?
是否用胶带测试确保镀金的附着力？"
"Is X-ray measurement used to measure Au/Ni thickness measurement ,If not what measurement?
是否适用X-RAY测量镍/金厚度，若没有，用什么进行测试？"
"How long between carbon treatments?
碳处理之间的时间是多长？"
"Is porosity test performed to ensure G/F having very fine deposition?
是否对板子进行多个孔测试以确保镀金板很好的沉积？"
Subsection scores 部分得分
Section 14 - Solder Mask 防焊
"Is their a pre-startup checklist for the preclean lines? Is it current(completely filled in)?
前处理线是否有开机点检表？其是否已经运行（完整的填写）？"
"Is there objective evidence that the precleaning chemistries are being analyzed by the laboratory at the documented frequency?
是否有客观证据说明前处理化学药水有被化验室按照文件规定的程序进行分析？"
"Is the soldermask preclean process being run per the current procedure, i.e. the speed, chemical concentration?
防焊前处理是否按照程序进行运行，即，速度，化学药水污染？"
"Are the panels completely dry (esp. in the holes) after the air dryer?
板子在热风烘干后是否完全烘干（例如，孔）？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有的在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is their positive air pressure from the cleanroom at the preclean line entrance into the cleanroom?
在前处理线进口的无尘室到无尘室是否有很好的空气压力？"
"Is their a pre-startup checklist for the soldermask coaters? Is it current(completely filled in)?
是否有防焊涂布机的开机点检表？是否已经运行（填写完整）？"
" Are the boards place in trays can separate boards one by one but not stack?
板子是否可以一片一片通过而无堆叠？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is the viscosity of the solder mask after preparation checked to ensure the quality?
在检验前是否测试防焊的粘性以确保品质？"
"Is the date and time that the soldermask expires after preparation specified on its container?
在准备相应的容器前是否确认防焊油墨有没有过期？"
"Is there evidence to demonstrate that all soldermasks are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否能证明所有的防焊油墨储存在温湿度管控的环境内？另外，是否有先进先出及过期管控目录？"
"Are the soldermask coaters (printers) cleaned and maintained to a documented procedure?
防焊涂布机是否按照文件规定进行清洁与维护？"
"If soldermask screen printers are used, is the silk-screen stencil life cycle controlled?
是否使用防焊网版印刷，并对网版适用寿命进行管控？"
" Is the screen tension checked before each use?
是否每次在使用之前检查网版张力？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定重工程序及其相应的品质检验？"
"Are thermal profiles performed on the tack dry ovens on a documented schedule? Is there objective evidence that it is being performed?
是否按照文件规定计划进行烤箱热循环测试？是否有客观证据其有执行？"
"Is their a pre-startup checklist for the exposure units? Is it current(completely filled in)?
是否在曝光机开启前有点检表？是否已经运行（填写完整）？"
"Is there appropriate verification of the artwork before use to check for damage, eg AOI?
在底片开始使用前是否有相应的确认并检查其有无损坏，例如，使用AOI检验？"
"Is there inspection criteria applied for S/M with documented pass/fail criteria?
S/M是否有规定的相应检验标准以判定PASS/FAIL标准？"
"Is there a documented S/M strip/rework procedure after coat or expose with the maximum number of reworks identified?
是否有文件规定涂布或曝光S/M 剥膜/重工程序定义其最大重工次数？"
"Is there a documented process for requesting compensated S/M artwork for registration problems?
是否有文件规定S/M底片对准度补偿要求问题？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定允许重工程序并有相应的品质检验？"
"Is the artwork stored appropriately to prevent damage and ensure the consistent scaling?
底片是否储存在相应的地方以避免损坏，从而保证其精确度？"
"Is the max holding time between expose and develop documented and followed?
是否有文件规定曝光和显影之间最大的静置时间并有按照此要求执行？"
"Is their a pre-startup checklist for the Develop line? Is it current(completely filled in)?
显影线是否有启动点检表？是否已经运行（完整的填写）？"
"Are the panels observed coming off the developer line clean, dry and stain free?
显影线后的板子是否检验其清洁度，干燥度与无污染？"
"Is there a documented S/M strip/rework procedure with proper quality controls and traceability?
S/M 剥膜/重工是否有文件规定程序并有相应的品质管控和跟踪？"
"Is the solder mask thickness effectively monitored? How?
防焊厚度效果是否进行监控？如何监控？"
"Is a S/M cure monitored on a routine/documented procedure? Does objective evidence exist?
S/M固化是否有按照文件要求进行监控？是否有客观证据？"
"Is a final inspection performed on the panels after cure to the requirements in the Spec ? (e.g. adhesion, thickness, etc)
固化后是否有最终检验以确认是否在要求的规格内？（例如：附着力，厚度，等）"
"Is the same S/M material used for touch-up & repair as was originally coated on the PCB?
修一/修补是否使用与PCB原本涂布相同材质的S/M？"
"Are tack dry/final cure ovens cleaned & calibrated as part of the routine maintenance?
烘干/最终固化烤箱是否定作为维护的一部分定期清洁/校准？"
"Is the viscosity of the carbon ink checked after preparation to ensure that it mets documented requirements?
准备后是否检验碳墨的粘性以确保符合文件规定的要求？"
"Are all carbon ink are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
所有的碳墨是否储存在管控的温度/湿度环境内？并且有到期日起先进先出管控目录？"
"Is the date and time that the carbon ink expires after preparation specified on its container?
碳墨的有效日期是否有標示在容器外？"
"Is the screen developing performed in a clean area with adequate ventilation?
网印清洁是否在通风清洁的环境内完成？"
"Are silk-screen stencils identified with labels or plates which are visible when the stencil is in its racks or mounted in the printer
所有的网版是否有贴标签或在网版放入架子与安装在印刷机上可以识别？"
"Is there a documented requirement to inspect a stencil after it is cleaned?
网版清洁后是否有文件要求进行检验？"
Subsection scores 部分得分
Section 15 - Rounting / Punching 捞边/冲床
"Is the routing program checked prior to being released to production?
在开始量产前是否检验捞边程序？"
"Are panels fixtured with locked pins during routing?
捞边时板子是否有用固定PIN？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Is first article dimension checked on the bottom panel from each spindle before production start-up and on each subsequent rout machine / punching machine setup?
在开始量产前是否按照机器顺序/冲床对每个轴的最下面的板子检测其首件尺寸？"
"Is stack height controlled properly based on pinning and abrasive used?
是否根据PIN与研磨状况管控相应的堆叠高度？"
"Is there evidence to demonstrate that all routing bits, Punching tools, V-cut/Beveller knives are well controlled? Such as the life control?
是否有征募证明所有的捞边钻咀，冲床，V-CUT/刀片有很好的管控？例如，使用寿命管控？"
"Is mechanical dimension PCB specification (Fab drawing) available at inspection station under document control?
PCB机械尺寸规格是否按照文件要求在检验站进行管控？"
"Is there evidence to demonstrate that V-cut depth and board dimension are well controlled?
是否有证据证明V-CUT深度和板尺寸有被很好的管控？"
"Is there process documentation in place to identify Synaptics's V-groove requirements? Is it verified during setup and lot inspection
现场是否有文件规定synaptics 的V-CUT槽要求？在设计和批量检验时，是否进行确认？"
"Are output boards at the bottom of each spindle inspected the dimension?
每轴最下面的板子的板子是否检验尺寸？"
"Is the punching mould check prior to being released to production?
在开始量产前是否检验冲床？"
Subsection scores 部分得分
Section 16 - ENIG 化镍金
"Has the ENIG chemical supplier audited and approved process. Provide date of last audit?
化镍金化学药水供应商是否稽核并承认制程？提供上次稽核的资料？"
"Is there a pre-startup checklist for the plating line(s)? Is it current(completely filled in)?
电镀线启动时，是否有点检表？是否已经运行（完整的填写）？"
"Is there objective evidence that the chemistries are being analyzed by the laboratory on the documented frequency?
是否有客观证据证明实验室有按照文件规定的频率对化学药水进行分析？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"During production runs, are additional checks of controllers, pumps, bath levels, temperatures, agitation, and rinses performed every two hours?
生产时，是否对管控器，水泵,槽液水准，温度，胶东，与水洗等每2小时进行一次确认？"
"Are the chemical controls based on the process chemistry suppliers TDS?
是否根据化学药水供应商TDS对化学药水进行管控？"
"Are the maximum nickel and gold bath turnover before dump documented? Does objective evidence exist?
在倾倒之前是否有文件规定最大的镍/金槽更槽频率？是否有相关证据？"
"Is a first article checked performed on the first basket or rack to confirm process parameter to insure meeting nickel and gold thickness and other quality parameters?
是否进行收监检验以确认制程上第一个蓝或挂架参数以确保符合镍金厚度或其它品质要求？"
"Is the maximum idle time at temperature established for the plating line?
电镀线是否规定最大的保持温度时间？"
"Is the microetch rate monitored on a daily basis?
是否每天对微蚀进行监控？"
"Is the nickel tank on an automatic controller and do controller calibration records exist?
镍槽是否有自动控制器并且有控制器校准记录？"
"Are the process rack/baskets coating in good condition? and on an documented recoating schedule?
挂架/篮子镀层是否良好？是否有文件规定重新电镀的计划？"
"Is there a documented quality conformance procedure with accept/reject criteria for gold finger plating line malfuctions(chemistries out of spec. time, temperature, etc. interuptions) to insure the quality of the product in the plating line?
是否有文件规定的合格品程序作为镀金线的接受/判退标准。（化学药水，时间，温度等）是否确保电镀线的产品品质？"
"Is rework performed for ENIG? If so, what type of rework?
化镍金是否可以重工？若可以，是如何重工？"
"Is the IPC tape test performed on each lot for plating adhesion?
针对每批电镀附着力，是否使用IPC胶带测试？"
"Are the customer specific ENIG thickness requirements documented on the traveler?
是否有文件规定按照客人规定的化镍金厚度进行管控？"
"Are the XRF calibration records current and are appropriate XRF standards used to verify calibration?
目前是否有XRF校准记录于接近XRF标准的方法用于确认精确度？"
"Is X-ray measurement for Au/Ni/ thickness performed on every production rack?
是否针对每个挂架产品要求使用XR测试镍金厚度？"
"Are the deposition rates microinches/minute for the nickel & gold plating calculated and confirmed to meet the chemical supplier's recommended deposition rate each shift?
镍金电镀沉积率的统计方法是否为microinches/分，并每班对沉积率进行确认以与化学药水供应商建议的一致？"
"Is the solderability test being performed per J-STD-003, Category 2 to evaluate surface and hole solderability per IPC 6012 class 2 requirements?
焊锡性测试是否根据J-STD-003，第2章标准评估表面状况，根据IPC 6012 2级水准要求确认孔状况 ？"
"Is the solderability test frequency being performed at a minimum of once per lot?
焊锡性测试最小测试频率是否为每批一次？"
"Have interactive influences for corrosion of nickel & gold peel been studied and findings implemented? Idenify black pad precautions taken.
镍金腐蚀/剥离是否相互影响？是否PAD发黑有预警？"
"Have critical process parameter been identified on SPC and Cpk values monitored?
关键制程参数是否有要求用SPC与CPK值管控？"
"Is there a documented shutdown procedure for the entire plating line(s) that includes the critical steps for the nickel plating bath(temperature & nickel controller flushing)?
整个电镀线是否有停线程序，包括镀金槽的关键步骤（温度/湿度管控）？"
Subsection scores部分得分
Section 17 - Electrical Test 电测
"Are boards separated in a fool proof manner after test to avoid mixing passed and failed boards:
所有的板子在测试后是否有简单的区别方式以避免PASS/FAILED的板子相互混料？"
"Are temperature and humidity monitored to optimized test conditions?
温度/湿度是否管控在最优的测试条件下？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Does the test fixture passed the incoming inspection before they are used?
在使用之前，治具是否通过了进料检验？"
"Are the tools and fixtures associated with P/N and REV clearly identified?
治具是否与料号/版本一致？"
"Are all open / short test machine grounded?
OPEN/SHORT测试机器是否接地？"
"Is testing machine having self-check function before each shift machine start-up?
每次换机器前，机器是否有自我检验功能？"
"Is there procedure in place that clearly defines the ET fixture set up? Is there objective evidence that it is followed?
现场是否有程序明确规定EI证据的装配？是否有客观证据？"
"Are the tools and fixture checked at the start of each shift?
每次换班前是否对治具进行检验？"
"Is Debug performed in an isolated area to avoid mixing passed and failed boards?
是否有单独的除错区域避免PASS/FAILED板子混料？"
"Are boards re-tested after verification?
确认后是否对板子再次进行测试？"
"Are repaired PCB's subjected to a complete electrical test after repair?
修补后的板子是否再次进行电测？"
"Are the PCBs properly identified by their P/N, status, and traceability information?
是否对PCB的料号，状况，可跟踪性进行确认？"
"Are all passed/rejected boards properly labeled and segregated to avoid mixing or missing?
所有的PASS/REJECTED板是否有相应的标签并单独放置以避免混料？"
"Are there documented electrical test parameters in the Electrical Test area? Including the carbon ink resistance?
是否有文件规定电测工作区的相关参数，包括碳墨阻抗？"
"Is the open and short repair procedures documented and operators trained and certified?
是否有程序规定OPEN/SHORT修补并且作业员有受到培训并得到承认？"
"For trace repair, is the trace width under 5mil are not allowed for repair?
针对线路修补，是否有要求线径低于5mil的不允许修补？"
"Are weld repairs tape tested per IPC Spec?
是否根据IPC规格对焊接修补进行胶带测试？"
"Are the maximum number of repairs per Synaptics Specification documented in the Repair Area and is there objective evidence that it is being adhered too?
是否按照synaptics规范定义最大修补次数，并有证据证明有按照此执行？"
"Is the same S/M material used for touch-up & repair as was originally coated on the PCB?
修一/修补是否使用与PCB原印刷相同的S/M材料？"
"Are the soldermask touch-ups tape tested per IPC Spec?
是否按照IPC规格对防焊进行修补？"
"Is there documentation that identifies that can and cannot be repaired? Synaptics does not permit repair of carbon ink lines.
是否有文件规定某些不良不良修补？Synaptics不允许修补碳墨线？"
"Is the baking oven well calibrated?
是否对烤箱进行校准？"
"Are the passed boards marked properly with an electrical test stamp?
PASS的板子是否有相应的电测标记？"
"Are the electrical test equipment capabilities evaluated regularly?
是否对电测设备性能定期进行评估？"
Subsection scores部分得分
Section 18 - Final Inspection 最终检验
"Are customer specifications readily accessible, clearly legible, and understood in the inspection area?
是否可以轻松，简单，明确的在检验区查阅到客人的规范？"
"Are inspection stations equipped with magnified ring lights or stereo microscopes (10X min)?
检验站是否有放大镜或立式显微镜（最小10倍）？"
"Is there adequate lighting in the inspection area and at inspection stations?
检验区灯光是否充足？"
"Do the final QC inspectors have access to 30X + magnification or greater for defect verification?
最终Qc检验是否有用30倍或更多倍的放大镜以确认不良？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Is there a workmanship standard for touch up of final QC?
最终QC人员是否能了解相关的工艺标准？"
"Is there the standard handling work instruction put on site? Are the inspectors handling the board properly to avoid damage or mixing?
现场是否有标准作业程序？作业员操作是否合适以避免损坏或混料？"
"Is there a nonconforming procedure that clearly define the disposition of nonconforming boards? Are the nonconforming boards segregated properly?
是否有清楚明确的定义不合格品程序？不合格品是否隔离处理？"
"Is there a documented system to track the performance i.e. number of inspection escapes to the customer for each inspector? If the inspectors performance is poor, is there any re-training or job transition?
是否有规定系统跟踪状况，例如：检验编号以避免检验人员漏检？若检验人员检验能力不好，是否有进行再次培训或转换工作？"
"Are previous quality issues and customer complaints highlighted in inspection records for a given part number?
针对之前的品质问题和客户强烈抱怨的料号，是否有其检验记录？"
"Are the rejection data used for pareto analysis?
是否对判退数据作柏拉图分析？"
"Is the same S/M material used for touch-up & repair as was originally coated on the PCB?
修一/修补是否使用与PCB原印刷相同的S/M材料？"
"Are all in-process and final inspection reworks and touch-ups cross checked by final QC inspectors?
所有制程和最终检验重工品和修补品是否有最终品质检验人员检验？"
"Is there a documented procedure for generating FAI reports?
是否有按照文件要求作出FAI报告？"
"Are soldermask touchups adhesion tape tested IPC-TM-650, Method 2.4.28.1?
防焊修补是否根据IPC-TM-650，2.4.28.1方法用胶带测试其附着力？"
Subsection scores部分得分
Section 19 - Laboratory 实验室
"Are the IPC Spec requirements documented, procedures established and methods adhered too for microsection evaluations?
是否有规定IPC规格，建立程序与方法，进行切片效果确认？"
"Is there a documented system for Synaptics PCB fab drawing requirements (dielectric thickness, copper weights, surface copper, plating thickness, etc.) for microsection verification?
是否有文件规定synaptics PCB的要求（电解厚度，铜箔厚度，铜箔表面，电镀厚度等）进行切片确认？"
"Is there a formal system to provide feedback to Product Engineering, Process Engineering and Operations for microsection failures?
是否当作业员发现切片试验不良时，有正式的系统反馈给前工程，生技？"
"Are structural integrity microsection coupons prepared per IPC-TM-650, Method 2.1.1 or 2.1.1.2 with acceptability verified per IPC-6012, Class 2?
是否根据IPC-TM-650，2.1.1方法对切片取样或根据2.1.2.2 IPC-6012.2级水准对其接受标准进行判定？"
"Are structural integrity microsection performed at the rate of at least two per lot for FAI and one per date code for mass production?
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gdf1223 (威望:2) (湖北 武汉) 电子制造 品质工程部经理 - 懂得做人,学会处世
赞同来自: 寻香公子 、danielyangys
针对预清洁线是否有建立预先点检表单？是否已经执行（已经填写）？"
"Is there objective evidence that the scrub/preclean chemistries are being analyzed by the laboratory on the documented frequency?
刷磨/预清洁化学药水是否有证据证明其有按照实验室文件规定的频率进行分析？
"
"Are Dump and Remake schedules documented for the preclean line and objective evidence exist that they are being adhered too?
是否有证据证明预清洗倾槽与更曹计划有符合文件要求？"
"Is there an evidence to demonstrate that all chemicals are monitored and controlled as listed in WI?
是否有证据证明所有的化学品与WI上管控的物质有监督并管控？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有制程上的WIP与相应制定材料是否管控在制定的工作区内？"
"Is a water break test performed every shift to ensure quality of pre-clean?
槽液测试是否每班测试一次以确保预清洁品质良好？"
"Is their positive air pressure from the cleanroom at the preclean line entrance into the cleanroom?
无尘室的预清洁线入口到无尘室是否有良好的压力？"
Imaging 干膜
"Is the cleanroom well controlled by temperature, humidity and particles which meet 10K Max. requirement and out of control notification? Review objective evidence.
无尘室的温度，湿度与尘埃粒子是否按照10K最高要求管控，并且有管控实效通知系统？
审核客观证据."
"Are the resist lamination and exposure areas in the cleanroom utilizing yellow lighting and do all exterior windows have UV blocking film?
无尘室的压膜与曝光区是否用的是黄灯并且所有的外部窗户使用的是UV膜？"
"Is there objective evidence to demonstrate that all dry films and/or liquid resist are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否有证据可以证明干膜或是湿膜储存在温度与湿度管控的环境内？并且，到期管控有先进先出目录？"
"Are there tacky roller clean machines in front of the laminator?
在压膜前是否有粘尘滚轮清洁机器？"
"For dry film lamination, is the temperature of the lamination roller checked and verified using an infrared meter?
针对干膜压膜，是否检查了压膜滚轮的温度并使用红外线表进行确认？"
"Is there a documented resist inspection criteria with pass/fail guidelines?
是否有文件规定的干膜检验标准指导书以判定接受或判退？"
"Is all in-process WIP and materials properly identified and controlled in designate area? Including expiration date on age sensitive material?
所有的制程WIP与材料是否有相应的定义并管控在制定区域？包括老化敏感材料有效期过期？"
"Is there a documented resist strip/rework procedure with the maximum number of reworks identified?
是否有文件规定干膜剥膜/重工程序有定义最大的重工次数？"
"For dry film lamination, is the temperature of the lamination roller checked and verified using an infrared meter?
对干膜压膜，是否有对压膜滚轮温度进行检验并对红外线表表进行确认？"
"Is there a latest revision control on working film?
是否对工作菲林的最新版本进行管控？"
"Is there an evidence that a maximum number of exposures has been established and the number of exposure times of working film is monitored?
是否有证据表明管控了曝光的最大次数并对工作菲林曝光次数进行监控？"
"Is the artwork cleaned after defined exposure times using tacky roller? Review the condition of the tacky rollers.
在确定曝光次数后，是否使用粘尘滚轮对底片进行清洁？审核粘尘滚轮的状况？"
"Are there tools and procedures with tolerance limits in place for front-to-back registration verification during the artwork setup? Is it identified as a critical SPC parameter?
在底片设计阶段，是否确认了前后对准度的工具/制程最大公差？是否被定义为关键SPC参数？"
" Is the front to back verified during this process?
在这些制程是否对上下对准度进行确认？"
"Is the maximum number of permissible exposures documented with a system to track the number of exposures?
可允许的最大曝光次数是否有文件规定并有相应的系统对其跟踪？"
"Is there an evidence that the number of exposure times of working film is monitored and the artwork is not being used beyond documented useful life?
是否能证明菲林的曝光次数有进行监控并且底片没有超出文件规定的使用期限？"
" Is the max holding time between expose and develop documented and followed?
曝光和显影之间是否文件规定最大的静置时间并有按照此要求执行？"
"Is their a pre-startup checklist for the DES line? Is it current(completely filled in)?
DES 线是否有预启动点检表？是否已经进行（有完整地填写）？"
"Is there an evidence to demonstrate that all chemicals are monitored and controlled as listed in WI?
是否能证明所有的化学品有进行监控并有管控WI清单？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有的制程上WIP与材料是否有定义并管控在指定的区域？"
"Are defectives and rework schedules documented for the DES line and objective evidence exist that they are being follow?
DES线是否有文件规定不良品与重工计划，并且有客观证据说明有按照其要求执行？"
"Is a first article run prior to etching the lot to confirm etcher settings and linewidths?
在批量蚀刻前是否先进行首件确认，以保证蚀刻机设备与线径？"
"Is the etch unifomity monitored at least monthly and records maintained as a quality document?
是否至少定期稽核一次蚀刻站并有相应的维护记录作为品质文件？"
"Are the etcher conveyor speeds defined and documented by copper weight/thickness?
蚀刻机运作速度是否有规定并且有文件规定铜重量/厚度？"
"Is the filtration system adequate? What's the clean frequency and renew frequency?
过滤系统是否完善？清洁频率与更换频率是多少？"
"Are there documented maximum final rinse water contamination levels, rinse flow rates and are these verified by conductivity measurements?
是否有文件规定最大水洗污染水准，水洗流动率与对传导性进行确认？"
"Are the cores observed coming off the DES line clean, dry and stain free?
是否有专门的对DES线清洁，烘干与无沾污进行检验？"
"Does the stripping module contain a filtering system for the removal of the dry film resist?
剥膜机是否有过滤系统以去除干膜膜屑？"
"Are seperators used to separate each core (signals & power/grounds) to prevent scratches?
是否有作业员单独操作每个重要项目（信号，电能，地面）以防止刮伤？"
"Are there identified schedule of cleaning the seperaors?
是否规定作业员的清洁计划？"
"Is there a system in place to identify which linewidths to be measured on a core?
现场是否有系统规定主要测试哪条线径？"
"Are linewidth measurement frequency documented and is the frequency at a minimum of the first core, middle and last core off the line in the lot?
是否有文件规定线径测试的频率？"
Subsection scores部分得分
Section 6 - AOI of innerlayer 外层AOI
"Is AOI perform 100% inspection for all signal layers?
所有層數是否100%进行AOI检测？"
"Are all WIP properly identified and place in the desinated area?
所有的WIP是否有相应的规定并放置在指定的区域？"
"Are the power / ground layer inspected per historical statistics sampling plan?
是否对能源/接地层进行检验并按照抽样计划定期统计？"
"Are the AOI programs data base on customer's data and are all the critical AOI settings and programs established by Engineering?
是否根据客户资料制定AOI程序，并且由工程建立所与的AOI关键参数设备与程序？"
"Does the AOI program have appropriate parameters programed to cover minimum linewidths, minimum spacing, dishdowns, etc?
AOI程序是否有相应的参数，其涉及到最小线径，最小间距，等？"
"Is a standard defect board used to verify each AOI machine is catching all defects at the beginning of each shift?
是否有不良标准板用于确认每台AOI机是否能够在开始每批测试前测出所有的不良？"
"Is there a system in place to notify the Image Area for first articles with repeat defects?
现场是否系统要求干膜首件发现重复不良时作出相应的通知？"
"If excess random defects are detected on a lot is this information immediately fed back to the DES operation for review and action? i.e. excess copper, nicks, shorts, opens?
若一批内出现了各种不良，此信息是否立即反馈给DES作业员并审核其作业动作？例如：残铜，线路缺口，短路，断路？"
"Is the AOI defect verification performed on separate verification stations and defect data collected and reported in a meaningful manner?
AOI不良确认是否有独立的确认站并且有收集不良资料并进行有意义的报告？"
"Are repaired panels re-AOI to confirm all defects were found and repaired?
修补后的板子是否有重新过AOI确认找出的不良已经全部修补OK？"
"Are yields tracked daily at AOI and feedback loop to I/L process improvement team established? Are first pass yield and final yield targets defined?
AOI站的产率是否每日进行跟踪并及时反馈给I/L制程建立相应的改善小组？是否对直通率与最终生产率目标进行定义？"
"Are corrective actions taken if yields fall below target?
若产量低于目标，是否采取相应的改善措施？"
"Is pareto analysis used to determine the top defects? Is effective continuous improvement used to eliminate top defects?
是否针对最高不良项目有要求使用柏拉图进行分析？是否采取持续有效的改善方法以减少最高不良？"
"Does the rework instruction comply with Synaptics Spec and IPC specification?
重工指导书是否符合synaptics规格与IPC规范？"
"Is there clear instruction to scrap the parts if more than three open circuit found at rework?
是否有明确的说明若重工时超过3条线路断路，则报废？"
"Is the tape test and resistance measurement performed on the welded traces to ensure the reliability of repair?
是否针对已经焊接的线路进行胶带测试，以确保修补板的信赖性？"
Subsection scores部分得分
Section 7 - Lamination 压合
"Is there evidence exist that the Oxide Chemistry supplier has audited the line in the previous three months? If so, were actions taken?
是否能证明棕化药水供应商在3个月前有对棕化线进行稽核？若有这样做，是否采取了相应的措施？"
"Have DOEs been conducted to verify the optimum oxide thickness to ensure no delamination after thermal stress test?
是否有进行DOE确保最好的棕化厚度以保证在热压测试制程发生分层？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的地方？"
"Is the microetch rate monitored? Is it under SPC control with calculated control limits and are the charts & actions current?
是否对微蚀率进行监控？其是否有SPC图管控并有正在进行的措施？"
"Are oxide bond strength test performed for all material types for each oxide line used on Synaptics Product on a weekly basis?
氧化粘合强度测试是否针对synaptica产品的所有材料类型的每条线每周进行一次测试？"
"Are the oxide chemistries on a auto-dosing system?
棕化药水是否有定量给料系统？"
"Is DI water used for rinses?
是否使用DI水进行水洗？"
Are the cores exiting the machine dry and stain free? 机器是否干燥并无污染？
"Is there an evidence that black oxide thickness is well controlled?
是否能证明黑化厚度有很好的管控？"
"Are the oxided panels uniform in color, appearance and free of scratches/handling damage?
氧化板是否颜色统一，外表无刮伤/或操作导致损坏？"
"Is ionic contamination test conducted once/shift as defined in the Synaptics specification?
离子污染测试是否按照synaptics规范要求每次换班执行一次？"
"Are cores reworked at oxide? If so, is there a documented rework procedure with the maximum number of reworks established?
氧化线是否重工？若有重工，是否有文件规定最大重工次数？"
"Is the lay-up done in a clean room with adequate temperature and humidity control?
叠合线无尘室是否有相应的温度与湿度管控？"
"Are there established hold-times for oxide cores in tha layup operation?
是否规定氧化线-叠合作业的静置时间？ "
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的地方？"
"Is there a procedure in place to insure the stack-up is performed per layup provided and approved by Synaptics?
现场是否有文件以确保每对预叠有按照synaptics承认的要求执行？"
"Is the material profile done regularly to ensure the actual cooldown rate not exceed 5 deg C / minute? What is the heat rise and cool down rate?
是否定期检查以确保实际降温率不超过5度/分？温度升温与降温速率是多少？"
"Are steel plates cleaned for each cycle and polished periodically? Is the thickness of the steel plate checked regularly?
每批钢板是否定期清洁并打磨？钢板的厚度是否定期检查其厚度？"
"Is there an evidence that lamination press platen flatness/parallelism is checked a minimum of once/six months?
是否能证明压合平台是否平整/平行并至少1-6个月检查一次？"
"Is board thickness measured after lamination on all panels or on appropriate sample size at a min 5 points on each panel?
压合后的板厚是否进行抽樣检验, 对每PNL至少检验的5个点？"
"Is there X-ray punch with accuracy compensation design for registration control?
X-RAY冲床是否管控对准度的设计补偿精确度？"
"Is there a documented quality inspection procedure for resin spots on laminated panels?
是否有品质检验程序文件对压合板数脂沾污进行定义？"
"Is the Tg and delta Tg checked weekly for all material types used for Synaptics product on each lamination press?
所有用于synaptics型号的板材，是否每周对压合产品检测一次TG与△TG？"
"Does there exist a documented accept/reject criteria at pre-drill x-ray for misregistration?
是否有文件规定X-RAY钻孔对准度的接受/判退标准？"
"Is there a documented routine dimensional measurement confirmation performed on the x-ray pre-drill measurement system?
是否有文件定义对X-RAY钻孔系统进行尺寸测量确认？"
Subsection scores部分得分
Section 8 - Drilling 钻孔
"Does the drilling machine have broken bit and wrong bit size detection capability?
钻孔机是否有破损钻咀与不良钻咀尺寸鉴定能力？"
"Does the traveller clearly define all the drilling parameters including stack height?
钻孔机是否能够清楚地定义钻孔参数，包括堆叠厚度？"
"Is the drilling program checked prior to being released for production?
是否在开始生产国产前，对钻孔程序进行检验？"
"Is there evidence to demonstrate that spindle run-out is well controlled?
是否能证明钻轴偏移管控良好？"
"Is the stack height, maximum hit per drill bit, and feeds and speeds as a function of laminate type, board thickness, layer count and hole size controlled properly?
堆叠高度，每钻咀的最大钻次，进刀速度是否对板材类型，板厚，曾数，与孔尺寸进行管控？"
"Are drill bit registration checked by cross-section or X-ray? What is the frequency?
是否通过切片或X-RAY对钻咀对准度进行检验？频率是多少？"
"Do action plans exist for investigating and reducing broken bits? Does objective evidence exist that this is in control?
是否对钻咀破损有调查改善计划并减少了不良次数？是否有客观证据证明已经有管控此项？"
"Is there a documented drill rework/repair procedure with quality checks?
是否有文件规定钻孔重工/修补程序并有相关品质点检表？"
"Are PCB's with missing holes placed back on the drill machine and drilled?
所有PCB漏钻孔位于钻孔机台面上已经钻过的位置？"
"Are resharpened drill bit inspected and identified prior to use?
再次研磨的钻咀是否在使用前进行检验与确认？"
"Are the maximum number of re-sharpens documented & controlled?
是否有文件规定并对最大研磨次数进行管控？"
"Are Aluminum plates inspected for dents and scratches before use?
在使用之前是否对铝板进行检验，以确保无凹陷与刮伤？"
"Are output boards at the bottom of each spindle inspected on the hole size & location, hole registration and hole quantity etc?
每轴底部的板子是否检验其孔尺寸，孔位，孔对准度与孔数量等？"
"Is there a general inspection procedure with Drilling accuracy, Hole size, Hole quantity, Hole location and Copper surface appearance defined?
对钻孔精确度，孔径，孔数量，孔位与铜箔表面确认，是否有相应的检验程序？"
"Are drill machines capability data for hole position accuracy traceable for each machine and spindle?
钻孔机孔位对准度能力数据是否对每台机器/每轴进行跟踪？"
"Are drill machines capability data for runout traceable for each machine and spindle?
钻孔机偏移度是否追踪到每台机器/每轴？
"
"Is registration monitored by Perfect Test machine or X-ray check after Drilling?
在钻孔后是否通过良品测试机器或X-RAY检验其对准度？"
"Is SPC used in Drilling process?
钻孔制程是否使用SPC？"
"Are all passed/rejected boards properly labeled and segregated to avoid mixing or missing?
所有的PASS/REJECT板是否贴有相应的标签以避免混料或遗失？"
"Does all in process WIP and materials be properly identified and controlled?
所有的WIP制程是否有相应的定义并进行管控？"
"Is there a SPC control implemented and control chart updated for critical parameters?
是否有SPC管控并有最近更新关键参数管控？"
"Are relevant corrective actions taken toward all the out of control points?
所有超出管控的项目是否有相应的改善对策？"
Subsection scores部分得分
Section 9 - Electroless 化学沉铜
"Is there a pre-startup checklist for the Deburr line? Is it current(completely filled in)?
去毛刺线是否有启动前点检表？是否已经运行（完整填写）？"
"Are there air knives, fluid heads & ultrasonics on the deburr machine?
去毛刺机器是否有风刀，流动性&超声波？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Is a hole inspection/checker used after deburr for plugged holes? If so, are the data used for continuous improvement activities.
在去冲孔孔内毛刺后，是否检验孔？若有，是否有持续改善的资料？"
"Are the surface of the boards and holes completely dry after deburr process?
去毛刺后，板面与孔是否完全干燥？"
"Is there a pre-startup checklist for the Desmear line? Is it current?
去毛刺线是否有开机点检表？目前是否运行？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Are the temperatures, pumps, bath condition, tanks/sumps and process times on the line within the process specifications?
生产线上的温度，抽水机，槽液条件等是否管控在制程规范内？"
"Is there an evidence that chemical analysis is performed periodically?
是否能证明化学药水分析有定期完成？"
"Is there a pre-startup checklist for the electroless line? Is it current (completely filled in)?
化学沉铜线是否有开机点检表？目前是否运行（完整填写）？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Is backlight inspection performed to check the coverage of the electroless copper including both sides of the hole?
是否检查化学沉铜的孔两面的背光？"
"Is dummy-plating performed as part of the start-up procedure before electroless copper plating product?
化学沉铜在开始生产前是否有进行是试镀？"
"Is there a documented quality conformance procedure with accept/reject criteria for electroless plating line malfuctions(hoist, time, temperature, etc. interuptions) to insure the quality of the product in the line at the time of malfunction?
化学沉铜线生产是否有规定的品质确认程序的判定接受/判退标准。（提升，时间，温度，等）以确保线上的生产品质？"
"Is there an active continuous improvement team for plating voids in the electroless copper operation?
化学沉铜是否对电镀空洞有积极的持续改善小组？"
"Is SPC used for Desmear and Electroless process ? Is the corrective action taken for the out of control status?
去胶渣与化学沉铜制程是否使用SPC？ 超出管控要求时，是否采取相应的改善措施？"
"Are the plating current and programs used documented on traveler?
天车电镀电流与程序是否有规定的文件？"
"Is incoming water tested with PH and organics?
新增加水是否测试PH与有机物？"
"Is the contamination of the plating tank monitored regularly?
电镀槽污染是否定期进行监控？"
"Is vibration used? How often is the vibration checked?
是否对其搅拌？搅拌确认频率是多少？"
"Are filters managed properly? Clean frequency, renew frequency?
过滤器管控是否恰当？清洁频率，更新频率是多少？"
"Is there an established carbon treatment schedule with a maximum frequency of treating each plating tank every six months?
每个电镀槽最大处理频率为每6个月一次，是否建立碳处理计划？"
"Are cross-sections performed as an in-process plating control?
制程电镀管控是否有进行切片确认？"
"Is there a documented quality conformance procedure with accept/reject criteria for plating line malfuctions(hoist, time, temperature, etc. interuptions) to insure the quality of the product in the press?
电镀线生产是否有规定的品质确认程序的判定接受/判退标准。（提升，时间，温度，等）以确保线上的生产品质？"
"Are plating distributions performed on each plating tank on a monthly basis?
是否每月进行一次电镀槽药液添加？"
"Is there a documented allowable rework procedure with appropriate quality checks?
相应品质检验是否有文件规定允许重工？"
"If product is reworked, is the rework documented on the traveler, and does the reworked product receive appropriate re-inspection and testing?
若产品重工，是否有重工文件规定，并且有重工品再次检验时相应的接受标准？"
Subsection scores部分得分
Section 10 - Outerlayer 外层
"Is there a pre-startup checklist for the preclean line? Is it current(completely filled in)?
前处理线启动时是否有点检表？是否已经运行（填写完整）？"
"Is there objective evidence that the scrub/preclean chemistries are being analyzed by the laboratory on the documented frequency?
是否能证明有文件规定实验室有对刷磨/前处理化学药水分析，并规定其分析频率？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有制程WIP与材料是否有相应的定义并管控在指定的区域？"
"Are the panels as observed coming off the preclean line clean, dry and stain free?
前处理后，是否观察板面有清洁度，干燥度与无污染？"
"Is the cleanroom well controlled by temperature, humidity and particles which meet 10K Max. requirement and out of control notification? Review objective evidence.
无尘室的温度，湿度，尘埃粒子是否管控良好，其符合10K最高要求，并且，超过规格时有相应通知？审核客观证据。"
"Is the cleanroom positive pressure monitored on a regular basis with alarms for out of control notification?
无尘室压力是否管控良好并且当超过管控范围时有报警系统？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有制程WIP与材料是否有相应的定义并管控在指定的区域？"
"Are the resist lamination and exposure areas in the cleanroom utilizing yellow lighting and do all exterior windows have UV blocking film?
无尘室的压膜与曝光区是否用的是黄灯并且所有的外部窗户使用的是UV膜？"
"Is there objective evidence to demonstrate that all dry films and/or liquid resist are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否能够证明所有的干膜/或湿膜均管控在相应的温度/湿度范围之内？
并且，有先进先出过期日期管控目录？"
"Is the temperature of the PCB panel/ lamination roller checked and verified using the infrared meter at the entrance to the dry film laminator?
是否在进行干膜压膜时，对PCB温度/压合滚轮进行红外线确认？"
"Is there inspection criteria applied for dry film lamination with documented pass/fail criteria? (eg, bubble, tension force)
干膜压膜是否有规定的检验标准以判定PASS/Fail？（例如：气泡，张力）"
"Are resist defective panels due to the lamination or coating process fully exposed before resist removal i.e. stripped?
压膜或涂布制程在去膜前的不良板是否在去膜前（例如：剥膜）完全曝光？"
"Is the artwork cleaned after defined exposure times using tacky roller? Review the condition of the tacky rollers.
在确定曝光次数后是否使用粘尘滚轮对底片进行清洁？审核清洁滚轮状况？"
"Are first articles processed through Outerlayer Develop & AOI prior to exposing the remainder of the lot? Is the front to back verified during this process?
在批量之前，是否对外层显影或AOI进行首件确认？此制程是否校准上下对准度？"
"Is the front-to-back registration on layers measured and controlled?
是否测试并管控层间上下对准度？"
"Is the maximum number of permissible exposures documented with a system to track the number of exposures?
可允许的最大曝光次数是否有文件规定并有系统对曝光次数进行跟踪？"
"Is the artwork segregated and destroyed after the maximum number of exposures have been reached?
当底片达到最大曝光次数后是否隔离并处理掉 ？"
" Is the max holding time between expose and develop documented and followed?
曝光与显影之间的静置时间是否有文件规定并有按照其要求执行？"
"Is there a pre-startup checklist for the develop line? Is it current(completely filled in)?
显影线是否有启动前有点检表？目前是否已经执行（完整的填写）？"
"Is a first article run prior to developing the lot to confirm developer settings and linewidths?
是否在批量显影前做首件以确认显影设备与线径？"
"Are there documented maximum final rinse water contamination levels, rinse flow rates and are these verified by conductivity measurements?
是否有文件规定最大最终水洗污染水准，水流率与传导性测试？"
"Are the panels observed coming off the developer line clean, dry and stain free?
显影线后是否对板面检查清洁度，干燥度，与无污染度？"
"Is there a system in place to identify the linewidths to be measured on a panel?
现场是否有系统对板面线径进行测量？"
"Are all repaired boards identified for traceability?
所有的修补板是否有规定并可以追踪？"
"Is there a documented maximum hold time for panels with laminated photoresist before copper plating
是否有文件规定干膜压膜到镀铜之间的最大静置时间？"
Subsection scores部分得分
Section 11 - AOI of Outerlayer 外层AOI
"Is 100% AOI performed on outlayer? If No, what's the sample size?
外层是否100%进行AOI？若没有，抽样频率是多少？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有定义并管控在指定的区域？"
"Is there a system in place to notify the Image Area for first articles with repeat defects?
当影像转移区首件重复发现不良时是否有通知系统？"
"Is the AOI defect verification performed on separate verification stations and defect data collected and reported in a meaningful manner?
AOI不良确认是否有独立的确认站，收集不良数量并进行有意义的报告？"
"Is there a documented procedure identifing the maximum number of repairs allowed, including but not limited too welding opens, cutting out shorts and excess copper spots, etc?
是否有文件规定允许修补的最大次数，包括但不限于OPEN焊接，处理短路或残铜等？"
"Is there a set limit of no. of failure that the lot should reviewed by a MRB team?
是否设置不良數量限定，以使MRB小组审核？"
"Are repaired panels re-AOI to confirm all defects were found and repaired?
修补的板子是否重新过AOI以确认所有的不良是否已经找到并修补？"
"Are all repaired boards identified for traceability?
修补的板子是否可以确定其跟踪性？"
"Are yields tracked daily at AOI and feedback loop to O/L process improvement team established? Are first pass yield and final yield targets defined?
AOI站生产率是否每天进行跟踪ing反馈给建立的品质改善小组？是否对直通率与最终达成率进行定义？"
"Are corrective actions taken if yields fall below target?
若生产率低于目标是否采取改善措施？"
"Is golden boards used to check the AOI machine before the inspection of each shift?
在每次换班前是否用AOI机器检验镀金板？"
"Is prateo analysis used to determine the top defects? Is effective continuous improvement used to eliminate top defects?
针对已经确定的最高不良项目是否有柏拉图进行分析？是否使用有效的改善对策以减少不良？"
"Does the rework instruction specify welding conditions and number of welds? For Synaptics product is this procedure defined based on IPC-7721 ?
重工指导书是否规定焊接条件与焊接次数？Synaptics产品是否根据IPC-7721定义？"
"Is the tape test and resistance measurement performed on the welded traces to ensure the reliability of repair? Is there any controlled for the number of welds?
是否对焊接处进行胶带测试或阻抗测试以确保修补后的信赖性？焊接次数是否有管控？"
Subsection scores部分得分
Section 12 - Plating 电镀
"Is there a pre-startup checklist for the electrolytic copper plating line? Is it current(completely filled in)?
电镀制程启动是否有点检表？是否已经执行（完整的填写）？"
"Do the plating current and program used match the design and traveler? What is the ASF range used during plating? Who determines ASF? How?
电镀电流与程序是否符合设计要求？电镀时的ASF范围是多少？谁确定ASF？如何确认？"
"Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？"
"Is dummy-plating performed as part of the start-up procedure before plating product?
在电镀前是否作为启动程序执行试镀？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Is all chemistry utilizing (DI) water?
化学药水是否使用DI水？"
"Is their an estblished schedule for the anode, buss bars and cables maintenance? Is it current?
是否建立阳极，电镀条鱼电缆的维护计划？是否已经运行？"
"Is the filter bag cleaned and checked periodically to ensure no plugging and broken?
是否定期对过滤袋进行清洁与检验以确保无堵塞于破损？"
"Is there an established carbon treatment schedule with a maximum frequency of treating each plating tank every six months?
是否建立碳处理计划并确定其频率最大为每个电镀槽每6个月进行一次？"
"Is PTH and small via hole wall quality checked by cross-section and followed by a closed loop corrective action?
是否通过切片检验PTH与小导通孔孔壁状况，并有相应的改善对策跟踪？"
"Is the specification for copper thickness documented on the traveler and other quality documents?
铜厚是否有规定的规范？"
"Is there a feedback loop to pre-production engineering to provide hole size data to insure the hole sizes are centered on nominal and have a good Cpk?
前工程提供的孔径是否有相应的反馈跟踪以确保孔径的中心值正常并有很好的CPK？"
"Are plating distributions performed each plating tank on a monthly basis?
每个电镀槽是否每月进行药水添加？"
"Are thermal stressed cross-sections performed as an in-process plating control?
制程电镀管控是否有热应力切片试验？"
"Is there an evidence that expiration date of all wet materials are well controlled?
是否能证明所有的潮湿材料的过期日期有很好的管控？"
"Is there an evidence that plated through hole reliability testing is conducted on periodic basis that meets the requirements in SYNA specification?
是否能证明孔德信赖性测试由定期执行以符合syna规范要求？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定可以重工的程序与相应的品质检验要求？"
"If product is reworked, is the rework documented on the traveler, and does the reworked product receive appropriate re-inspection and testing?
若产品重工，是否有相应的重工文件并且重工品有接受相应的再次检验与测试？"
"Are Dump and Remake schedules documented for the strip-etch-strip and objective evidence exist that they are being adhered too?
报废与重工计划是否规定要求有 剥膜-蚀刻-剥膜的客观证据？"
"Is their a manifold nozzle layout & conveyor schedule available and is it used to validate correct equipment setup?
是否有喷嘴设计图/转运计划并且其用于改善设备布局？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is the filtration system adequate? What's the clean frequency and renew frequency?
过滤系统是否完善？其清洁频率与更新频率是多少？"
"Is a first article run prior to etching the lot to confirm etcher settings and linewidths?
在批量蚀刻前是否进行首件与确认蚀刻机设备与线径？"
"Are there documented maximum final rinse water contamination levels, rinse flow rates and are these verified by conductivity measurements?
是否有文件规定最大水洗污染水准？"
"Are slip sheets used to separate each panel to prevent scratches?
每片板之间是否有分隔胶片以避免刮伤？"
"Is there a system in place to identify the linewidths to be measured on a panel?
是否有系统要求对线径的测量进行定义？"
"Are fine pitch SMT pad size measured and SPC utilized?
SMT PAD 是否测试其节距并适用SPC进行管控？"
"Are the panels observed coming off the SES line clean, dry and stain free?
板子从SES线下来后，是否检验清洁度，烘干度与无污染？"
Subsection scores部分得分
Section 13 - Gold Plating 镀金
"Is their a pre-startup checklist for the preclean lines? Is it current(completely filled in)?
前处理线是否有启动点检表？是否已经运行（完整的填写）？"
"Is there objective evidence that the preclean chemistries are being analyzed by the laboratory on the documented frequency?
是否能证明前处理化学药水有被化验室按照文件要求的频率进行分析？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有的在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is there a documented process for select the plating current or program to match the different Gold and Nickel thickness?
是否有文件规定电镀电流或要求符合不同的电镀金厚？"
"Does the spray nozzle checked before each shift operation?
在每班转班前是否检查喷嘴？"
"Is there an evidence to demonstrate that the PCB surface cleanliness is monitored and controlled? Water break test?
是否能证明PCB表面清洁状况有进行监控与管控？是否有水不良测试？"
"Is a first article setup panel run to confirm process parameter to insure meeting nickel and gold thickness and other quality parameters before processing the remainder of the lot?
在开始量产前是否运作首件以确保制程参数，保证其符合镍和金厚等其他品质参数？"
"Is there a documented quality conformance procedure with accept/reject criteria for gold plating line malfuctions(chemistries out of spec. time, temperature, etc. interuptions) to insure the quality of the product in the plating line?
是否有品质合格品程序文件规定镀金板的接受与判退标准。（化学药水，时间，温度等超出规格），以确保电镀线品质标准？"
"Does the traveler or other process documentation specify the Nickel/Gold thickness ?
是否有文件规定镍金厚度？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定允许的重工程序和相应的品质检验？"
"Is the tape test performed to make sure the adhesion of gold plating?
是否用胶带测试确保镀金的附着力？"
"Is X-ray measurement used to measure Au/Ni thickness measurement ,If not what measurement?
是否适用X-RAY测量镍/金厚度，若没有，用什么进行测试？"
"How long between carbon treatments?
碳处理之间的时间是多长？"
"Is porosity test performed to ensure G/F having very fine deposition?
是否对板子进行多个孔测试以确保镀金板很好的沉积？"
Subsection scores 部分得分
Section 14 - Solder Mask 防焊
"Is their a pre-startup checklist for the preclean lines? Is it current(completely filled in)?
前处理线是否有开机点检表？其是否已经运行（完整的填写）？"
"Is there objective evidence that the precleaning chemistries are being analyzed by the laboratory at the documented frequency?
是否有客观证据说明前处理化学药水有被化验室按照文件规定的程序进行分析？"
"Is the soldermask preclean process being run per the current procedure, i.e. the speed, chemical concentration?
防焊前处理是否按照程序进行运行，即，速度，化学药水污染？"
"Are the panels completely dry (esp. in the holes) after the air dryer?
板子在热风烘干后是否完全烘干（例如，孔）？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有的在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is their positive air pressure from the cleanroom at the preclean line entrance into the cleanroom?
在前处理线进口的无尘室到无尘室是否有很好的空气压力？"
"Is their a pre-startup checklist for the soldermask coaters? Is it current(completely filled in)?
是否有防焊涂布机的开机点检表？是否已经运行（填写完整）？"
" Are the boards place in trays can separate boards one by one but not stack?
板子是否可以一片一片通过而无堆叠？"
"Is all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定区域？"
"Is the viscosity of the solder mask after preparation checked to ensure the quality?
在检验前是否测试防焊的粘性以确保品质？"
"Is the date and time that the soldermask expires after preparation specified on its container?
在准备相应的容器前是否确认防焊油墨有没有过期？"
"Is there evidence to demonstrate that all soldermasks are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
是否能证明所有的防焊油墨储存在温湿度管控的环境内？另外，是否有先进先出及过期管控目录？"
"Are the soldermask coaters (printers) cleaned and maintained to a documented procedure?
防焊涂布机是否按照文件规定进行清洁与维护？"
"If soldermask screen printers are used, is the silk-screen stencil life cycle controlled?
是否使用防焊网版印刷，并对网版适用寿命进行管控？"
" Is the screen tension checked before each use?
是否每次在使用之前检查网版张力？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定重工程序及其相应的品质检验？"
"Are thermal profiles performed on the tack dry ovens on a documented schedule? Is there objective evidence that it is being performed?
是否按照文件规定计划进行烤箱热循环测试？是否有客观证据其有执行？"
"Is their a pre-startup checklist for the exposure units? Is it current(completely filled in)?
是否在曝光机开启前有点检表？是否已经运行（填写完整）？"
"Is there appropriate verification of the artwork before use to check for damage, eg AOI?
在底片开始使用前是否有相应的确认并检查其有无损坏，例如，使用AOI检验？"
"Is there inspection criteria applied for S/M with documented pass/fail criteria?
S/M是否有规定的相应检验标准以判定PASS/FAIL标准？"
"Is there a documented S/M strip/rework procedure after coat or expose with the maximum number of reworks identified?
是否有文件规定涂布或曝光S/M 剥膜/重工程序定义其最大重工次数？"
"Is there a documented process for requesting compensated S/M artwork for registration problems?
是否有文件规定S/M底片对准度补偿要求问题？"
"Is there a documented allowable rework procedure with appropriate quality checks?
是否有文件规定允许重工程序并有相应的品质检验？"
"Is the artwork stored appropriately to prevent damage and ensure the consistent scaling?
底片是否储存在相应的地方以避免损坏，从而保证其精确度？"
"Is the max holding time between expose and develop documented and followed?
是否有文件规定曝光和显影之间最大的静置时间并有按照此要求执行？"
"Is their a pre-startup checklist for the Develop line? Is it current(completely filled in)?
显影线是否有启动点检表？是否已经运行（完整的填写）？"
"Are the panels observed coming off the developer line clean, dry and stain free?
显影线后的板子是否检验其清洁度，干燥度与无污染？"
"Is there a documented S/M strip/rework procedure with proper quality controls and traceability?
S/M 剥膜/重工是否有文件规定程序并有相应的品质管控和跟踪？"
"Is the solder mask thickness effectively monitored? How?
防焊厚度效果是否进行监控？如何监控？"
"Is a S/M cure monitored on a routine/documented procedure? Does objective evidence exist?
S/M固化是否有按照文件要求进行监控？是否有客观证据？"
"Is a final inspection performed on the panels after cure to the requirements in the Spec ? (e.g. adhesion, thickness, etc)
固化后是否有最终检验以确认是否在要求的规格内？（例如：附着力，厚度，等）"
"Is the same S/M material used for touch-up & repair as was originally coated on the PCB?
修一/修补是否使用与PCB原本涂布相同材质的S/M？"
"Are tack dry/final cure ovens cleaned & calibrated as part of the routine maintenance?
烘干/最终固化烤箱是否定作为维护的一部分定期清洁/校准？"
"Is the viscosity of the carbon ink checked after preparation to ensure that it mets documented requirements?
准备后是否检验碳墨的粘性以确保符合文件规定的要求？"
"Are all carbon ink are stored in temperature and humidity control environment? Also, inventoried under FIFO with expired date control?
所有的碳墨是否储存在管控的温度/湿度环境内？并且有到期日起先进先出管控目录？"
"Is the date and time that the carbon ink expires after preparation specified on its container?
碳墨的有效日期是否有標示在容器外？"
"Is the screen developing performed in a clean area with adequate ventilation?
网印清洁是否在通风清洁的环境内完成？"
"Are silk-screen stencils identified with labels or plates which are visible when the stencil is in its racks or mounted in the printer
所有的网版是否有贴标签或在网版放入架子与安装在印刷机上可以识别？"
"Is there a documented requirement to inspect a stencil after it is cleaned?
网版清洁后是否有文件要求进行检验？"
Subsection scores 部分得分
Section 15 - Rounting / Punching 捞边/冲床
"Is the routing program checked prior to being released to production?
在开始量产前是否检验捞边程序？"
"Are panels fixtured with locked pins during routing?
捞边时板子是否有用固定PIN？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Is first article dimension checked on the bottom panel from each spindle before production start-up and on each subsequent rout machine / punching machine setup?
在开始量产前是否按照机器顺序/冲床对每个轴的最下面的板子检测其首件尺寸？"
"Is stack height controlled properly based on pinning and abrasive used?
是否根据PIN与研磨状况管控相应的堆叠高度？"
"Is there evidence to demonstrate that all routing bits, Punching tools, V-cut/Beveller knives are well controlled? Such as the life control?
是否有征募证明所有的捞边钻咀，冲床，V-CUT/刀片有很好的管控？例如，使用寿命管控？"
"Is mechanical dimension PCB specification (Fab drawing) available at inspection station under document control?
PCB机械尺寸规格是否按照文件要求在检验站进行管控？"
"Is there evidence to demonstrate that V-cut depth and board dimension are well controlled?
是否有证据证明V-CUT深度和板尺寸有被很好的管控？"
"Is there process documentation in place to identify Synaptics's V-groove requirements? Is it verified during setup and lot inspection
现场是否有文件规定synaptics 的V-CUT槽要求？在设计和批量检验时，是否进行确认？"
"Are output boards at the bottom of each spindle inspected the dimension?
每轴最下面的板子的板子是否检验尺寸？"
"Is the punching mould check prior to being released to production?
在开始量产前是否检验冲床？"
Subsection scores 部分得分
Section 16 - ENIG 化镍金
"Has the ENIG chemical supplier audited and approved process. Provide date of last audit?
化镍金化学药水供应商是否稽核并承认制程？提供上次稽核的资料？"
"Is there a pre-startup checklist for the plating line(s)? Is it current(completely filled in)?
电镀线启动时，是否有点检表？是否已经运行（完整的填写）？"
"Is there objective evidence that the chemistries are being analyzed by the laboratory on the documented frequency?
是否有客观证据证明实验室有按照文件规定的频率对化学药水进行分析？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"During production runs, are additional checks of controllers, pumps, bath levels, temperatures, agitation, and rinses performed every two hours?
生产时，是否对管控器，水泵,槽液水准，温度，胶东，与水洗等每2小时进行一次确认？"
"Are the chemical controls based on the process chemistry suppliers TDS?
是否根据化学药水供应商TDS对化学药水进行管控？"
"Are the maximum nickel and gold bath turnover before dump documented? Does objective evidence exist?
在倾倒之前是否有文件规定最大的镍/金槽更槽频率？是否有相关证据？"
"Is a first article checked performed on the first basket or rack to confirm process parameter to insure meeting nickel and gold thickness and other quality parameters?
是否进行收监检验以确认制程上第一个蓝或挂架参数以确保符合镍金厚度或其它品质要求？"
"Is the maximum idle time at temperature established for the plating line?
电镀线是否规定最大的保持温度时间？"
"Is the microetch rate monitored on a daily basis?
是否每天对微蚀进行监控？"
"Is the nickel tank on an automatic controller and do controller calibration records exist?
镍槽是否有自动控制器并且有控制器校准记录？"
"Are the process rack/baskets coating in good condition? and on an documented recoating schedule?
挂架/篮子镀层是否良好？是否有文件规定重新电镀的计划？"
"Is there a documented quality conformance procedure with accept/reject criteria for gold finger plating line malfuctions(chemistries out of spec. time, temperature, etc. interuptions) to insure the quality of the product in the plating line?
是否有文件规定的合格品程序作为镀金线的接受/判退标准。（化学药水，时间，温度等）是否确保电镀线的产品品质？"
"Is rework performed for ENIG? If so, what type of rework?
化镍金是否可以重工？若可以，是如何重工？"
"Is the IPC tape test performed on each lot for plating adhesion?
针对每批电镀附着力，是否使用IPC胶带测试？"
"Are the customer specific ENIG thickness requirements documented on the traveler?
是否有文件规定按照客人规定的化镍金厚度进行管控？"
"Are the XRF calibration records current and are appropriate XRF standards used to verify calibration?
目前是否有XRF校准记录于接近XRF标准的方法用于确认精确度？"
"Is X-ray measurement for Au/Ni/ thickness performed on every production rack?
是否针对每个挂架产品要求使用XR测试镍金厚度？"
"Are the deposition rates microinches/minute for the nickel & gold plating calculated and confirmed to meet the chemical supplier's recommended deposition rate each shift?
镍金电镀沉积率的统计方法是否为microinches/分，并每班对沉积率进行确认以与化学药水供应商建议的一致？"
"Is the solderability test being performed per J-STD-003, Category 2 to evaluate surface and hole solderability per IPC 6012 class 2 requirements?
焊锡性测试是否根据J-STD-003，第2章标准评估表面状况，根据IPC 6012 2级水准要求确认孔状况 ？"
"Is the solderability test frequency being performed at a minimum of once per lot?
焊锡性测试最小测试频率是否为每批一次？"
"Have interactive influences for corrosion of nickel & gold peel been studied and findings implemented? Idenify black pad precautions taken.
镍金腐蚀/剥离是否相互影响？是否PAD发黑有预警？"
"Have critical process parameter been identified on SPC and Cpk values monitored?
关键制程参数是否有要求用SPC与CPK值管控？"
"Is there a documented shutdown procedure for the entire plating line(s) that includes the critical steps for the nickel plating bath(temperature & nickel controller flushing)?
整个电镀线是否有停线程序，包括镀金槽的关键步骤（温度/湿度管控）？"
Subsection scores部分得分
Section 17 - Electrical Test 电测
"Are boards separated in a fool proof manner after test to avoid mixing passed and failed boards:
所有的板子在测试后是否有简单的区别方式以避免PASS/FAILED的板子相互混料？"
"Are temperature and humidity monitored to optimized test conditions?
温度/湿度是否管控在最优的测试条件下？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Does the test fixture passed the incoming inspection before they are used?
在使用之前，治具是否通过了进料检验？"
"Are the tools and fixtures associated with P/N and REV clearly identified?
治具是否与料号/版本一致？"
"Are all open / short test machine grounded?
OPEN/SHORT测试机器是否接地？"
"Is testing machine having self-check function before each shift machine start-up?
每次换机器前，机器是否有自我检验功能？"
"Is there procedure in place that clearly defines the ET fixture set up? Is there objective evidence that it is followed?
现场是否有程序明确规定EI证据的装配？是否有客观证据？"
"Are the tools and fixture checked at the start of each shift?
每次换班前是否对治具进行检验？"
"Is Debug performed in an isolated area to avoid mixing passed and failed boards?
是否有单独的除错区域避免PASS/FAILED板子混料？"
"Are boards re-tested after verification?
确认后是否对板子再次进行测试？"
"Are repaired PCB's subjected to a complete electrical test after repair?
修补后的板子是否再次进行电测？"
"Are the PCBs properly identified by their P/N, status, and traceability information?
是否对PCB的料号，状况，可跟踪性进行确认？"
"Are all passed/rejected boards properly labeled and segregated to avoid mixing or missing?
所有的PASS/REJECTED板是否有相应的标签并单独放置以避免混料？"
"Are there documented electrical test parameters in the Electrical Test area? Including the carbon ink resistance?
是否有文件规定电测工作区的相关参数，包括碳墨阻抗？"
"Is the open and short repair procedures documented and operators trained and certified?
是否有程序规定OPEN/SHORT修补并且作业员有受到培训并得到承认？"
"For trace repair, is the trace width under 5mil are not allowed for repair?
针对线路修补，是否有要求线径低于5mil的不允许修补？"
"Are weld repairs tape tested per IPC Spec?
是否根据IPC规格对焊接修补进行胶带测试？"
"Are the maximum number of repairs per Synaptics Specification documented in the Repair Area and is there objective evidence that it is being adhered too?
是否按照synaptics规范定义最大修补次数，并有证据证明有按照此执行？"
"Is the same S/M material used for touch-up & repair as was originally coated on the PCB?
修一/修补是否使用与PCB原印刷相同的S/M材料？"
"Are the soldermask touch-ups tape tested per IPC Spec?
是否按照IPC规格对防焊进行修补？"
"Is there documentation that identifies that can and cannot be repaired? Synaptics does not permit repair of carbon ink lines.
是否有文件规定某些不良不良修补？Synaptics不允许修补碳墨线？"
"Is the baking oven well calibrated?
是否对烤箱进行校准？"
"Are the passed boards marked properly with an electrical test stamp?
PASS的板子是否有相应的电测标记？"
"Are the electrical test equipment capabilities evaluated regularly?
是否对电测设备性能定期进行评估？"
Subsection scores部分得分
Section 18 - Final Inspection 最终检验
"Are customer specifications readily accessible, clearly legible, and understood in the inspection area?
是否可以轻松，简单，明确的在检验区查阅到客人的规范？"
"Are inspection stations equipped with magnified ring lights or stereo microscopes (10X min)?
检验站是否有放大镜或立式显微镜（最小10倍）？"
"Is there adequate lighting in the inspection area and at inspection stations?
检验区灯光是否充足？"
"Do the final QC inspectors have access to 30X + magnification or greater for defect verification?
最终Qc检验是否有用30倍或更多倍的放大镜以确认不良？"
"Are all in-process WIP and materials properly identified and controlled in designate area?
所有在制品WIP与材料是否有相应的定义并管控在指定的区域？"
"Is there a workmanship standard for touch up of final QC?
最终QC人员是否能了解相关的工艺标准？"
"Is there the standard handling work instruction put on site? Are the inspectors handling the board properly to avoid damage or mixing?
现场是否有标准作业程序？作业员操作是否合适以避免损坏或混料？"
"Is there a nonconforming procedure that clearly define the disposition of nonconforming boards? Are the nonconforming boards segregated properly?
是否有清楚明确的定义不合格品程序？不合格品是否隔离处理？"
"Is there a documented system to track the performance i.e. number of inspection escapes to the customer for each inspector? If the inspectors performance is poor, is there any re-training or job transition?
是否有规定系统跟踪状况，例如：检验编号以避免检验人员漏检？若检验人员检验能力不好，是否有进行再次培训或转换工作？"
"Are previous quality issues and customer complaints highlighted in inspection records for a given part number?
针对之前的品质问题和客户强烈抱怨的料号，是否有其检验记录？"
"Are the rejection data used for pareto analysis?
是否对判退数据作柏拉图分析？"
"Is the same S/M material used for touch-up & repair as was originally coated on the PCB?
修一/修补是否使用与PCB原印刷相同的S/M材料？"
"Are all in-process and final inspection reworks and touch-ups cross checked by final QC inspectors?
所有制程和最终检验重工品和修补品是否有最终品质检验人员检验？"
"Is there a documented procedure for generating FAI reports?
是否有按照文件要求作出FAI报告？"
"Are soldermask touchups adhesion tape tested IPC-TM-650, Method 2.4.28.1?
防焊修补是否根据IPC-TM-650，2.4.28.1方法用胶带测试其附着力？"
Subsection scores部分得分
Section 19 - Laboratory 实验室
"Are the IPC Spec requirements documented, procedures established and methods adhered too for microsection evaluations?
是否有规定IPC规格，建立程序与方法，进行切片效果确认？"
"Is there a documented system for Synaptics PCB fab drawing requirements (dielectric thickness, copper weights, surface copper, plating thickness, etc.) for microsection verification?
是否有文件规定synaptics PCB的要求（电解厚度，铜箔厚度，铜箔表面，电镀厚度等）进行切片确认？"
"Is there a formal system to provide feedback to Product Engineering, Process Engineering and Operations for microsection failures?
是否当作业员发现切片试验不良时，有正式的系统反馈给前工程，生技？"
"Are structural integrity microsection coupons prepared per IPC-TM-650, Method 2.1.1 or 2.1.1.2 with acceptability verified per IPC-6012, Class 2?
是否根据IPC-TM-650，2.1.1方法对切片取样或根据2.1.2.2 IPC-6012.2级水准对其接受标准进行判定？"
"Are structural integrity microsection performed at the rate of at least two per lot for FAI and one per date code for mass production?