1.0 Scope This procedure is a rapid means for evaluating
glass epoxy laminate integrity on different lots of base laminate
materials before placing materials on the production
floor, and thereby reducing the cost of processing material
which may later prove to be defective.
2.0 Applicable Documents
IPC-A-600 Acceptability of Printed Boards
IPC-MI-660 Guidelines for Incoming Inspection of Raw Materials
3.0 Specimens The samples of qualification or incoming
production test coupons shall be 4.0 inch x 4.0 inch x 1/16
inch thick (see 7.1) and etched using the standard commercial
practices procedure of the individual test facility. The test
coupons can be taken from any part of the laminate. The test
strip may be sheared, but the individual test coupons shall be
sawed and their edges sanded.
4.0 Number of Test Coupons to be Tested Five coupons
shall be tested and may arbitrarily contain a known ‘‘pass’’
and ‘‘fail’’ control coupon. However, if a failure mode is established,
a second set of 5 samples shall be tested from another
laminate and this set must contain a pass and fail control. The
number of test coupons tested at any one time should be limited
to the capacity of the pressure vessel being used.
5.0 Apparatus
5.1 Any standard laboratory autoclave pressure vessel having
a 6-quart capacity. A commercial household 6-quart stainless
steel pressure cooker capable of developing 15 psi pressure
(the 15 psi pressure set at the location of the test) may
be used if equipped with a properly calibrated pressure gauge
to maintain 15 psi ± 0.5 psi pressure.
5.2 A laboratory solder pot capable of maintaining a solder
bath (SN 60) at 500°F –0° + 10°F.
5.3 Stop watch.
5.4 Solder pot containing SN 60/40 solder.
6.0 Test
6.1 Preparation
6.1.1 Cut test coupons only by sawing, and sand the edges
of the specimens so they are smooth.
6.1.2 Etch specimens to remove metal foil except in any
areas which may have identification codes.
6.1.3 Apply permanent identification markings on specimens
on the end that will not be immersed in the solder pot.
6.1.4 The specimens will be placed in a suitable rack for
suspending in the pressure vessel. The specimens should not
be drilled for suspension as this creates a path for moisture
incursion, giving false results.
6.1.5 Pour water into pressure vessel to approximately 1.0
inch depth. Cover and bring to a boil without pressurizing.
6.2 Test
6.2.1 When steam is observed at the vent, uncover and
suspend specimens vertically over boiling water, being careful
not to allow specimens to touch each other or the walls of the
pressure vessel. This step must be done rapidly to avoid
undue cooling of the water and pressure vessel.
6.2.2 The heat-up time should be controlled at 7 minutes ±
1 minute.
6.2.3 After reaching 15 psi. maintain this condition for 30
minutes + 2 –0 minutes.
Note: Other pressure vessel dwell times may be agreed upon
between user and vendor.
6.2.4 At the end of the exposure time, cool and vent the
pressure vessel as recommended by the manufacturer.
6.2.5 Carefully remove the hot specimens from the pressure
vessel and blot dry with paper towel (see caution notes).
6.2.6 The specimens shall be maintained at ambient temperature,
and within 10 minutes it shall be immersed vertically
(with the edge parallel to the solder surface) into the solder
bath which is maintained at either 500°F –0 + 10°F for 20
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST METHODS MANUAL
Number
2.6.16
Subject
Pressure Vessel Method for Glass Epoxy Laminate
Integrity
Date
7/85
Revision
Originating Task Group
N/A
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
seconds. Immersion and withdrawal rates should not exceed
2 seconds. Do not allow test coupons to touch bottom of solder
bath.
Note: Other solder bath temperatures maybe agreed upon by
user and vendor.
6.3 Evaluation
6.3.1 Do not evaluate areas within 1/8 inch from all edges,
including solder line.
6.3.2 Grading Grade specimens on the evaluation scale of
5 through 1 (below) according to degree of severity of the
attack. In order for the grading to be more meaningful, the
tester should also provide comments on the overall specimen
appearance. For additional description and illustrations of
measles, blisters, weave texture, delamination, etc., refer to
IPC-A-600, Acceptability Guidelines for Printed Wiring.
Value Condition
5 The samples have no measles, blisters, or surface
erosion.
4 Occasional minute (1/32 inch or less) measles.
3 Minute measles scattered across the specimen.
2 Occasional minor blisters (two to four adjacent
weave intersections).
1 Large blisters, delamination, or convolution.
If five test coupons are evaluated, the test may use a total
performance points-rating (e.g., 5 x 5 = 25).
7.0 Notes
7.1 This test method is developed for 1/16 inch thick material.
Different results are to be expected for other thicknesses.
Therefore, the time of exposure and grading values may
change for different thicknesses and must be agreed upon
between user and vendor.
7.2 Warning Pressure vessel must always be opened with
extreme caution to be certain pressure has been released.
7.3 Warning Samples could retain some moisture. Therefore,
care should be taken in immersing the sample in the solder
bath. It is recommended that the operator work behind a
suitable protective screen and use a glove to protect the hand
holding the sample. The wet specimens will react violently
during the immersion into the solder pot, splaying and sputtering
bits of molten solder about the fume hood. Proper precautionary
measures must be taken.
IPC-2616-1
CONDITION 1
IPC-2616-2
CONDITION 2
IPC-TM-650
Number
2.6.16
Subject
Pressure Vessel Method for Glass Epoxy Laminate Integrity
Date
7/85
Revision
Page 2 of 3
IPC-2616-3
CONDITION 3
IPC-2616-4
CONDITION 4
IPC-2616-5
CONDITION 5
IPC-TM-650
Number
2.6.16
Subject
Pressure Vessel Method for Glass Epoxy Laminate Integrity
Date
7/85
Revision
Page 3 of 3
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1.0 Scope This procedure is a rapid means for evaluating
glass epoxy laminate integrity on different lots of base laminate
materials before placing materials on the production
floor, and thereby reducing the cost of processing material
which may later prove to be defective.
2.0 Applicable Documents
IPC-A-600 Acceptability of Printed Boards
IPC-MI-660 Guidelines for Incoming Inspection of Raw Materials
3.0 Specimens The samples of qualification or incoming
production test coupons shall be 4.0 inch x 4.0 inch x 1/16
inch thick (see 7.1) and etched using the standard commercial
practices procedure of the individual test facility. The test
coupons can be taken from any part of the laminate. The test
strip may be sheared, but the individual test coupons shall be
sawed and their edges sanded.
4.0 Number of Test Coupons to be Tested Five coupons
shall be tested and may arbitrarily contain a known ‘‘pass’’
and ‘‘fail’’ control coupon. However, if a failure mode is established,
a second set of 5 samples shall be tested from another
laminate and this set must contain a pass and fail control. The
number of test coupons tested at any one time should be limited
to the capacity of the pressure vessel being used.
5.0 Apparatus
5.1 Any standard laboratory autoclave pressure vessel having
a 6-quart capacity. A commercial household 6-quart stainless
steel pressure cooker capable of developing 15 psi pressure
(the 15 psi pressure set at the location of the test) may
be used if equipped with a properly calibrated pressure gauge
to maintain 15 psi ± 0.5 psi pressure.
5.2 A laboratory solder pot capable of maintaining a solder
bath (SN 60) at 500°F –0° + 10°F.
5.3 Stop watch.
5.4 Solder pot containing SN 60/40 solder.
6.0 Test
6.1 Preparation
6.1.1 Cut test coupons only by sawing, and sand the edges
of the specimens so they are smooth.
6.1.2 Etch specimens to remove metal foil except in any
areas which may have identification codes.
6.1.3 Apply permanent identification markings on specimens
on the end that will not be immersed in the solder pot.
6.1.4 The specimens will be placed in a suitable rack for
suspending in the pressure vessel. The specimens should not
be drilled for suspension as this creates a path for moisture
incursion, giving false results.
6.1.5 Pour water into pressure vessel to approximately 1.0
inch depth. Cover and bring to a boil without pressurizing.
6.2 Test
6.2.1 When steam is observed at the vent, uncover and
suspend specimens vertically over boiling water, being careful
not to allow specimens to touch each other or the walls of the
pressure vessel. This step must be done rapidly to avoid
undue cooling of the water and pressure vessel.
6.2.2 The heat-up time should be controlled at 7 minutes ±
1 minute.
6.2.3 After reaching 15 psi. maintain this condition for 30
minutes + 2 –0 minutes.
Note: Other pressure vessel dwell times may be agreed upon
between user and vendor.
6.2.4 At the end of the exposure time, cool and vent the
pressure vessel as recommended by the manufacturer.
6.2.5 Carefully remove the hot specimens from the pressure
vessel and blot dry with paper towel (see caution notes).
6.2.6 The specimens shall be maintained at ambient temperature,
and within 10 minutes it shall be immersed vertically
(with the edge parallel to the solder surface) into the solder
bath which is maintained at either 500°F –0 + 10°F for 20
The Institute for Interconnecting and Packaging Electronic Circuits
2215 Sanders Road • Northbrook, IL 60062-6135
IPC-TM-650
TEST METHODS MANUAL
Number
2.6.16
Subject
Pressure Vessel Method for Glass Epoxy Laminate
Integrity
Date
7/85
Revision
Originating Task Group
N/A
Material in this Test Methods Manual was voluntarily established by Technical Committees of the IPC. This material is advisory only
and its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of this
material. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent infringement.
Equipment referenced is for the convenience of the user and does not imply endorsement by the IPC.
Page 1 of 3
seconds. Immersion and withdrawal rates should not exceed
2 seconds. Do not allow test coupons to touch bottom of solder
bath.
Note: Other solder bath temperatures maybe agreed upon by
user and vendor.
6.3 Evaluation
6.3.1 Do not evaluate areas within 1/8 inch from all edges,
including solder line.
6.3.2 Grading Grade specimens on the evaluation scale of
5 through 1 (below) according to degree of severity of the
attack. In order for the grading to be more meaningful, the
tester should also provide comments on the overall specimen
appearance. For additional description and illustrations of
measles, blisters, weave texture, delamination, etc., refer to
IPC-A-600, Acceptability Guidelines for Printed Wiring.
Value Condition
5 The samples have no measles, blisters, or surface
erosion.
4 Occasional minute (1/32 inch or less) measles.
3 Minute measles scattered across the specimen.
2 Occasional minor blisters (two to four adjacent
weave intersections).
1 Large blisters, delamination, or convolution.
If five test coupons are evaluated, the test may use a total
performance points-rating (e.g., 5 x 5 = 25).
7.0 Notes
7.1 This test method is developed for 1/16 inch thick material.
Different results are to be expected for other thicknesses.
Therefore, the time of exposure and grading values may
change for different thicknesses and must be agreed upon
between user and vendor.
7.2 Warning Pressure vessel must always be opened with
extreme caution to be certain pressure has been released.
7.3 Warning Samples could retain some moisture. Therefore,
care should be taken in immersing the sample in the solder
bath. It is recommended that the operator work behind a
suitable protective screen and use a glove to protect the hand
holding the sample. The wet specimens will react violently
during the immersion into the solder pot, splaying and sputtering
bits of molten solder about the fume hood. Proper precautionary
measures must be taken.
IPC-2616-1
CONDITION 1
IPC-2616-2
CONDITION 2
IPC-TM-650
Number
2.6.16
Subject
Pressure Vessel Method for Glass Epoxy Laminate Integrity
Date
7/85
Revision
Page 2 of 3
IPC-2616-3
CONDITION 3
IPC-2616-4
CONDITION 4
IPC-2616-5
CONDITION 5
IPC-TM-650
Number
2.6.16
Subject
Pressure Vessel Method for Glass Epoxy Laminate Integrity
Date
7/85
Revision
Page 3 of 3