Solder ability test for RoHS component

Solder ability test for RoHS component
1.1 The standard of solder ability for lead-free wave flow solder component:
Samples size: 5pcs
Pre-process: The samples’ terminals should be immersed in the flux
(recommend use: Vital GW9810A-6A, YONO-6810) for 2±0.5
seconds, the immersion depth of terminals below their body of 1.5 ~
2.0mm.
Test method: After that, the terminals should be immersed in the solder bath set
at 265 -5/+0℃, for a duration of 2.5±0.5 seconds. Then, move them
out of solder bath.
Judgement: Inspect all immersed terminals, if the wetted area is uniform and
smooth, and newly wetted area compare immersed area is more
than 90%; Now we can judge component’ solder ability is OK.
1.2 The standard of solder ability for lead-free reflow solder component:
Samples size: 5pcs
Pre-process: The samples’ terminals should be immersed in the flux
(recommend use: Vital GW9810A-6A, YONO-6810) for 2±0.5
seconds,
Test method: After that, the terminals should be immersed in the solder bath set
at 255 -5/+0℃, for a duration of 2.5±0.5 seconds. At last, move them
out of solder bath.
Judgement: Inspect all immersed terminals; if the wetted area is uniform and
smooth, and newly wetted area compare immersed area is more
than 90%; Now we can judge component’ solder ability is OK.
NOTE：1. The sample is indivisibility (e.g. chip inductance, chip resistor, chip ceramic
capacitor). So we must immerse the whole sample in the solder bath to test the
solder ability of terminal. (chip electronic capacitor exempted )

[]If the sample body size is bigger or terminal length is longer than others[/]

component (e.g. Chip transformer); we can cut off the terminal from the body to
test the solder ability.

[]Composition of solder: 96.5%Sn+3.0%Ag+0.5%Cu[/]