電子元件烘烤標準（IPC/JEDEC J-STD-033A）

JOINT
INDUSTRY
STANDARD
Handling, Packing,
Shipping and Use of
Moisture/Reflow
Sensitive Surface
Mount Devices
IPC/JEDEC J-STD-033A
July 2002
Supersedes IPC/JEDEC J-STD-033
April 1999
Notice EIA/JEDEC and IPC Standards and Publications are designed to serve the
public interest through eliminating misunderstandings between manufacturers
and purchasers, facilitating interchangeability and improvement of products,
and assisting the purchaser in selecting and obtaining with minimum delay
the proper product for his particular need. Existence of such Standards and
Publications shall not in any respect preclude any member or nonmember of
EIA/JEDEC or IPC from manufacturing or selling products not conforming
to such Standards and Publications, nor shall the existence of such Standards
and Publications preclude their voluntary use by those other than EIA/JEDEC
and IPC members, whether the standard is to be used either domestically or
internationally.
Recommended Standards and Publications are adopted by EIA/JEDEC and
IPC without regard to whether their adoption may involve patents on articles,
materials, or processes. By such action, EIA/JEDEC and IPC do not assume
any liability to any patent owner, nor do they assume any obligation whatever
to parties adopting the Recommended Standard or Publication. Users are also
wholly responsible for protecting themselves against all claims of liabilities for
patent infringement.
The material in this joint standard was developed by the EIA/JEDEC JC-14.1
Committee on Reliability Test Methods for Packaged Devices and the IPC
Plastic Chip Carrier Cracking Task Group (B-10a)
For Technical Information Contact:
Electronic Industries Alliance/
JEDEC (Joint Electron Device
Engineering Council)
2500 Wilson Boulevard
Arlington, VA 22201
Phone (703) 907-7560
Fax (703) 907-7501
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone (847) 509-9700
Fax (847) 509-9798
Please use the Standard Improvement Form shown at the end of this
document.
©Copyright 2002. The Electronics Industries Alliance, Arlington, Virginia, and IPC, Northbrook, Illinois. All rights reserved under both
international and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the prior
written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.
IPC/JEDEC J-STD-033A
Handling, Packing,
Shipping and Use of
Moisture/Reflow
Sensitive Surface
Mount Devices
A joint standard developed by the EIA/JEDEC JC-14.1 Committee on
Reliability Test Methods for Packaged Devices and the B-10a Plastic
Chip Carrier Cracking Task Group of IPC
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
EIA/JEDEC
Engineering Department
2500 Wilson Boulevard
Arlington, VA 22201
Phone (703) 907-7500
Fax (703) 907-7501
IPC
2215 Sanders Road
Northbrook, IL 60062-6135
Phone (847) 509-9700
Fax (847) 509-9798
Supersedes:
IPC/JEDEC J-STD-033 -
April 1999
JEDEC JEP124
IPC-SM-786A - January 1995
IPC-SM-786 - December 1990
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES®
Acknowledgment
Members of the Joint IPC-EIA/JEDEC Moisture Classification Task Group have worked to develop this document. We
would like to thank them for their dedication to this effort. Any Standard involving a complex technology draws material
from a vast number of sources. While the principal members of the Joint Moisture Classification Working Group are shown
below, it is not possible to include all of those who assisted in the evolution of this Standard. To each of them, the members
of the EIA/JEDEC and IPC extend their gratitude.
IPC Packaged Electronic
Components Committee
Chairman
Martin Freedman
AMP, Inc.
IPC Plastic Chip Carrier
Cracking Task Group, B-10a
Chairman
Steven Martell
Sonoscan, Inc.
EIA/JEDEC JC 14.1
Committee
Chairman
Jack McCullen
Intel Corporation
EIA/JEDEC JC 14
Chairman
Nick Lycoudes
Motorola
Joint Working Group Members
Jasbir Bath, Solectron Corporation
James Mark Bird, Amkor Technology
Inc.
Michael W. Blazier, Delphi Delco
Electronic
Maurice Brodeur, Analog Devices
Inc.
Peter Brooks, Amkor Technology
Ralph Carbone, Hewlett Packard Co.
Henry Charest, Allegro MicroSystems
Inc.
Jeffrey C. Colish, Northrop Grumman
Corporation
Andrew Corriveau, Cogiscan
J. Gordon Davy, Northrop Grumman
Corporation
Werner Engelmaier, Engelmaier
Associates L.C.
Leo G. Feinstein, Leo Feinstein
Associate
Barry R. Fernelius, Agilent