半导体行业常用的一些缩写

AlF: Aluminum Fluoride. Fluoride residue from wafer fabrication combines with Aluminum on the die’s bond pads to form crystals on the bond pads, thereby preventing reliable
wire bonding at assembly.

Alumina: Aluminum Oxide = Al2O3: The most common, inexpensive & widely used ceramic substrate material.

BGA: Ball Grid Array.

BT: Bismaleimide Triazine; a common PBGA substrate material that is laminated in multiple layers with copper to provide electrical connections.

C4: Controlled Collapse Chip Connection; A solder joint between a substrate and a flip chip whose height is controlled by the surface tension of the liquid solder.

COB: Chip On Board. An unpackaged chip (a.k.a. KGD) directly attached to the end-product’s substrate (e.g. pager, phone, etc.). The chip may be either wire bonded, TAB
bonded or flip-chip bonded for making electrical connections. The chip is then given a glob-top coating for protection. Also referred to as Direct Chip Attach (DCA).

CSP: Chip Scale Package; a package with a footprint that is less than 25% larger than the die’s footprint.

CTE: Coefficient of Thermal Expansion; the change in linear dimension of a material per unit dimension per 1oC change, normally measured at 55oC. Expressed in 10-6 cm/cm/oC.

DCA: Direct Chip Attach. See “COB”.

Flip Chip: A die with solder bumps or gold bumps (i.e. no wire bonds) that is directly attached to a substrate then underfilled to relieve stresses on the bumps due to CTE mismatches.

FR4: A fire retardant epoxy resin/glass cloth laminate commonly used as a core material for printed circuit boards.
Glob Top Protective encapsulation over semiconductor die mounted directly on circuit board.
Heat Sink A method of conducting heat away from an area, usually a component die. May be internally or extermanlly mounted to a package.
Hermetic: Airtight. Technically, a package is hermetic if its gas leak rate is equal to or less than 10-8 cc of helium per second at a pressure differential of one atmosphere.

H-PBGA: High-thermal PBGA; a.k.a. OLGA and PLGA.

HL-PBGA: High-thermal, Low-profile PBGA; a.k.a. SuperBGA* and TBGA.
Interposer: A pseudo-package that is comprised of a ceramic or organic substrate that serves no purpose other than to transform the I/O pitch of a die and/or create a method of connecting a die to a circuit board, i.e. it does not fully surround and protect the die from the environment. Examples include the uBGA and OLGA packages.

JEDEC: Joint Electronic Device Engineering Counsel; creates industry standards like moisture sensitivity levels.

KGD: Known Good Die or Dice. Dice that undergo a wafer-level or die-level test for functionality and are sold to customers, unpackaged, for COB applications.

Land On a printed circuit, it is the conductive are to which components or separate circuits are attached.

Lead The conductor brought out from a component or circuit.

MMAP: Matrix Molded Array Package.

MSL: Moisture Sensitivity Level; the categorization of sensitivity of a package to moisture and thus its allowed ambient exposure time at the end customer. Exceeding the allowed exposure time creates a reliability jeopardy for popcorning. MSL applies only to surface mounted components, not through-hole mounted or socketed packages.

OLGA: Organic Land Grid Array.

PBGA: Plastic Ball Grid Array.

PCB: Printed Circuit Board.

PGA: Pin Grid Array. Customarily refers to the package version with the Alumina (ceramic) substrate; the version with a plastic substrate is denoted

PPGA for Plastic Pin Grid Array.

PLCC: Plastic Leaded Chip Carrier.

PLGA: Plastic Land Grid Array (essentially a PBGA without the solder balls attached).

PQFP: Plastic Quad Flat Pack.

SCSP: Stacked Chip Scale Package. A MMAP package with two dice, one stacked on top of the other. See also “CSP” and “MMAP”.

SECC: Single Edge Contact Cartridge.

SMT: Surface Mount Technology; a.k.a. SMD or Surface Mount Device. Any package that does not require holes in the mother board for mounting.

TAB: Tape Automated Bonding. A process in which precisely etched leads, supported on a flexible tape or plastic carrier, are automatically positioned over the bonding pads on a chip. A heated pressure head is then lowered over the assembly and simultaneously thermocompression-bonds (a.k.a gang-bonds) the leads to all the pads on the chip.

TBGA: Tape BGA; a HL-PBGA with a tape substrate instead of a BT substrate.